Abstract: This invention relates to thermal spreader incorporated into heat pipe coolers and water coolers for electronic components, said spreader having optimal aspect ratio T/(?S)?0.17 to provide optimal parameters of thermal resistance and lowering noise created by these coolers supplying by operating fans, where T is thickness of said thermal spreader and (?S) is square root of the surface area of the first surface of said thermal spreader. Further, the invention relates to electronic systems comprising said thermal spreader with optimal aspect ratio T/(?S)?0.17 to provide better thermal management of electronic components incorporated into these electronic systems.