Patents by Inventor Vadim Tsoi
Vadim Tsoi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12114467Abstract: The invention relates to a heatsink for transferring heat from one or more electrical devices to a heat transfer medium. The heatsink includes a plurality of fins arranged on a frontside of the heatsink. The plurality of fins includes a first group of fins extending in a first planar direction and a second group of fins extending in a second planar direction angled in relation to the first planar direction. For example, the first group of fins may extend from the bottom to the top of the heatsink, while the second group of fins may extend from the first group of fins to the sides of the heatsink. In this way, the sides of the heatsink can be used as air outlets and the airflow through the heatsink can be increased.Type: GrantFiled: July 22, 2022Date of Patent: October 8, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Magnus Kallmark, Fredrik Ohlsson, Vadim Tsoi, Reine Granstrom
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Publication number: 20240206126Abstract: An apparatus for transferring heat from a heat source to air, comprising a heat sink with a plurality of fins. A fin of the plurality of fins is configured as follows: the fin comprises a conduit arrangement for a heat-carrying fluid; in a boiling region of the fin, the conduit arrangement comprises a vapour guiding path; and in the boiling region, the conduit arrangement comprises one or more boiling chambers. Each of the one or more boiling chambers has an outer boundary. The respective boiling chamber is located within a chamber region defined by an imaginary quadrilateral having four sides and four vertices. By means of the arrangement and configuration of the boiling chambers and/or of the vapour guiding path, the heat transfer efficiency of the fin is improved.Type: ApplicationFiled: December 13, 2023Publication date: June 20, 2024Inventors: Dzmitry Kushner, Christoffer Jarpner, Vadim Tsoi, Fredrik Ohlsson, Ying Dong, Marcus Lundh
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Publication number: 20240023281Abstract: A heat spreader for transferring heat from an electronic heat source to a heat sink, a system for cooling an electronic heat source, and a method for manufacturing a heat spreader are provided. The heat spreader includes a set of separate channels which are coupled with each other by an upper coupler and a lower coupler such that a cooling fluid circulates in the set of separate channels via the upper coupler and the lower coupler in operation.Type: ApplicationFiled: September 28, 2023Publication date: January 18, 2024Inventors: Fredrik Ohlsson, Vadim Tsoi, Long Li
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Publication number: 20220361372Abstract: The invention relates to a heatsink for transferring heat from one or more electrical devices to a heat transfer medium. The heatsink includes a plurality of fins arranged on a frontside of the heatsink. The plurality of fins includes a first group of fins extending in a first planar direction and a second group of fins extending in a second planar direction angled in relation to the first planar direction. For example, the first group of fins may extend from the bottom to the top of the heatsink, while the second group of fins may extend from the first group of fins to the sides of the heatsink. In this way, the sides of the heatsink can be used as air outlets and the airflow through the heatsink can be increased.Type: ApplicationFiled: July 22, 2022Publication date: November 10, 2022Inventors: Magnus KALLMARK, Fredrik OHLSSON, Vadim TSOI, Reine GRANSTROM
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Publication number: 20220290926Abstract: An apparatus (102; 202; 302; 402; 502) for transferring heat from a heat source (104) to air when the apparatus (102; 202; 302; 402; 502) is connected to the heat source (104) is disclosed. The apparatus (102; 202; 302; 402; 502) has a heat sink (106; 206; 306; 406; 506) comprising a heat sink base (108; 208) and a plurality of primary fins (110; 210) connected to the heat sink base (108; 208). Further, the apparatus (102; 202; 302; 402; 502) includes a heat sink front (112; 212; 412; 512). The heat sink base (108; 208) is configured to be thermally coupled to the heat source (104). Each primary fin (110; 210) of the plurality of primary fins (110; 210) has one or more conduits (114; 214). The heat sink base (108; 208) includes a first chamber (116; 216). The first chamber (116; 216) and the conduits (114; 214) together form a common space sealed off from the ambient air surrounding the apparatus (102; 202; 302; 402; 502).Type: ApplicationFiled: June 2, 2022Publication date: September 15, 2022Inventors: Fredrik OHLSSON, Vadim TSOI
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Patent number: 10757832Abstract: A radio remote unit, including a unit body, and multiple heat dissipation fins that are disposed on a surface of the body, where an opening groove is disposed on the heat dissipation fin, and opening grooves on the multiple heat dissipation fins form a fan ventilation groove, where the fan ventilation groove is connected to ventilation channels between the heat dissipation fins, and a fan is disposed in a built-in manner in the fan ventilation groove. The fan ventilation groove formed by the opening grooves on the multiple heat dissipation fins is connected to the ventilation channels between the heat dissipation fins, and the fan is disposed, which implements that in a case in which a quantity of heat dissipation fins is unchanged, the fan performs air cooling on the radio remote unit, effectively improving a heat dissipation capability.Type: GrantFiled: January 30, 2019Date of Patent: August 25, 2020Assignee: Huawei Technologies Co., Ltd.Inventors: Weifeng Hu, Vadim Tsoi, Lei Li
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Publication number: 20190230815Abstract: A radio remote unit, including a unit body, and multiple heat dissipation fins that are disposed on a surface of the body, where an opening groove is disposed on the heat dissipation fin, and opening grooves on the multiple heat dissipation fins form a fan ventilation groove, where the fan ventilation groove is connected to ventilation channels between the heat dissipation fins, and a fan is disposed in a built-in manner in the fan ventilation groove. The fan ventilation groove formed by the opening grooves on the multiple heat dissipation fins is connected to the ventilation channels between the heat dissipation fins, and the fan is disposed, which implements that in a case in which a quantity of heat dissipation fins is unchanged, the fan performs air cooling on the radio remote unit, effectively improving a heat dissipation capability.Type: ApplicationFiled: January 30, 2019Publication date: July 25, 2019Inventors: Weifeng Hu, Vadim Tsoi, Lei Li
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Patent number: 10219406Abstract: A radio remote unit, including a unit body, and multiple heat dissipation fins that are disposed on a surface of the body, where an opening groove is disposed on the heat dissipation fin, and opening grooves on the multiple heat dissipation fins form a fan ventilation groove, where the fan ventilation groove is connected to ventilation channels between the heat dissipation fins, and a fan is disposed in a built-in manner in the fan ventilation groove. The fan ventilation groove formed by the opening grooves on the multiple heat dissipation fins is connected to the ventilation channels between the heat dissipation fins, and the fan is disposed, which implements that in a case in which a quantity of heat dissipation fins is unchanged, the fan performs air cooling on the radio remote unit, effectively improving a heat dissipation capability.Type: GrantFiled: September 2, 2015Date of Patent: February 26, 2019Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Weifeng Hu, Vadim Tsoi, Lei Li
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Patent number: 9941917Abstract: An embodiment of the present invention discloses a base station, including: a baseband unit, a radio remote unit, a power supply device, a signal transmission device, and a backup power supply device. The baseband unit and the radio remote unit are mounted on an antenna tower or a pole. At least one of the power supply device, the signal transmission device, or the backup power supply device is also mounted on the antenna tower or the pole.Type: GrantFiled: December 29, 2015Date of Patent: April 10, 2018Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Chenglong Wang, Fredrik Ohlsson, Vadim Tsoi
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Patent number: 9843250Abstract: An Electro Hydro Dynamic, EHD, thruster (105) comprising a first set of electrodes (210), a second set of electrodes (220) and a supporting structure (103) for supporting the first set of electrodes (210) and the second set of electrodes (220). The EHD thruster (105) is configured to generate airflow of ionized air for cooling a heat sink (101). Further, the EHD thruster (105) is electrically isolated from the heat sink (101).Type: GrantFiled: December 19, 2014Date of Patent: December 12, 2017Assignee: Huawei Technologies Co., Ltd.Inventors: Vadim Tsoi, Yake Fang
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Patent number: 9423192Abstract: A heat spreading device includes sectioning forming a first chamber portion and a second chamber portion, a first plurality of conduits, and a second at least two conduits. The second at least two conduits interconnect the first chamber portion and the second chamber portion. The heat spreading device may also include cavities, a barrier, and fins.Type: GrantFiled: November 18, 2011Date of Patent: August 23, 2016Assignee: Huawei Technologies Co., Ltd.Inventors: Vadim Tsoi, Uno Henningsson, Yuping Hong, Feng Peng, Hua Yang, Haipeng Li
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Publication number: 20160198523Abstract: An embodiment of the present invention discloses a base station, including: a baseband unit, a radio remote unit, a power supply device, a signal transmission device, and a backup power supply device. The baseband unit and the radio remote unit are mounted on an antenna tower or a pole. At least one of the power supply device, the signal transmission device, or the backup power supply device is also mounted on the antenna tower or the pole.Type: ApplicationFiled: December 29, 2015Publication date: July 7, 2016Applicant: HUAWEI TECHNOLOGIES CO.,LTD.Inventors: Chenglong WANG, Fredrik OHLSSON, Vadim TSOI
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Publication number: 20160079840Abstract: An Electro Hydro Dynamic, EHD, thruster (105) comprising a first set of electrodes (210), a second set of electrodes (220) and a supporting structure (103) for supporting the first set of electrodes (210) and the second set of electrodes (220). The EHD thruster (105) is configured to generate airflow of ionised air for cooling a heat sink (101). Further, the EHD thruster (105) is electrically isolated from the heat sink (101).Type: ApplicationFiled: December 19, 2014Publication date: March 17, 2016Inventors: Vadim TSOI, Yake FANG
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Publication number: 20150382504Abstract: A radio remote unit, including a unit body, and multiple heat dissipation fins that are disposed on a surface of the body, where an opening groove is disposed on the heat dissipation fin, and opening grooves on the multiple heat dissipation fins form a fan ventilation groove, where the fan ventilation groove is connected to ventilation channels between the heat dissipation fins, and a fan is disposed in a built-in manner in the fan ventilation groove. The fan ventilation groove formed by the opening grooves on the multiple heat dissipation fins is connected to the ventilation channels between the heat dissipation fins, and the fan is disposed, which implements that in a case in which a quantity of heat dissipation fins is unchanged, the fan performs air cooling on the radio remote unit, effectively improving a heat dissipation capability.Type: ApplicationFiled: September 2, 2015Publication date: December 31, 2015Inventors: Weifeng Hu, Vadim Tsoi, Lei Li
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Publication number: 20120111553Abstract: A heat spreading device of thermo siphon, the device comprising sectioning forming a first chamber portion and a second chamber portion, first plurality of conduits, and second at least two conduits, the second at least two conduits providing interconnection of the first and second chamber portions is disclosed. Integral parts/portions are provided, such as cavities, barrier and fins.Type: ApplicationFiled: November 18, 2011Publication date: May 10, 2012Inventors: Vadim Tsoi, Uno Henningsson, Yuping Hong, Feng Peng, Hua Yang, Haipeng Li
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Patent number: 7061763Abstract: A novel electronics cooling method and system is disclosed. A very flexible and efficient operation of an electronics cooling system (10) is achieved by controlling circulation of a cooling medium in a closed system (40) containing an evaporator (13), a condenser (14), an ejector (11) and control valves (15–18). Specifically, the system is continuously allowed to operate in the most appropriate mode by controlling the valves (15–18) of the system (10) based on detected heat load and/or detected heat transfer conditions. By automatically adapting the mode of operation of the system based on the actual prevailing conditions, a unique flexibility is obtained with regard to the cooling mode in which the system will be operated. This means that the cooling capacity will be constantly optimized and that the investment cost as well as the cost for operating the system will be reduced compared to known systems having equal maximum cooling capacity.Type: GrantFiled: January 29, 2002Date of Patent: June 13, 2006Assignee: Telefonaktiebolaget LM Ericsson (publ)Inventor: Vadim Tsoi
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Publication number: 20050083654Abstract: A novel electronics cooling method and system is disclosed. A very flexible and efficient operation of an electronics cooling system (10) is achieved by controlling circulation of a cooling medium in a closed system (40) containing an evaporator (13), a condenser (14), an ejector (11) and control valves (15-18). Specifically, the system is continuously allowed to operate in the most appropriate mode by controlling the valves (15-18) of the system (10) based on detected heat load and/or detected heat transfer conditions. By automatically adapting the mode of operation of the system based on the actual prevailing conditions, a unique flexibility is obtained with regard to the cooling mode in which the system will be operated. This means that the cooling capacity will be constantly optimized and that the investment cost as well as the cost for operating the system will be reduced compared to known systems having equal maximum cooling capacity.Type: ApplicationFiled: January 29, 2002Publication date: April 21, 2005Applicant: Telefonaktiebolaget LM Ericsson (publ)Inventor: Vadim Tsoi