Abstract: A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be applied to the preformed planar structure in order that flux is selectively applied to the solder balls (pads) on the chip and the substrate. The preformed planar structure may be provided with through holes in registration with the solder balls on the chip(s) and the substrate. In this case, liquid flux selectively fills the through holes for delivery to the solder balls during soldering. The through holes also aid in maintaining registration of the chip(s) and the substrate. The through holes may be sized to establish a predetermined mechanical structure of solder joints formed by the solder balls when fused together. The preformed planar structure has a planar core and opposing planar faces.

Abstract: A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be applied to the preformed planar structure in order that flux is selectively applied to the solder balls (pads) on the chip and the substrate. The preformed planar structure may be provided with through holes in registration with the solder balls on the chip(s) and the substrate. In this case, liquid flux selectively fills the through holes for delivery to the solder balls during soldering. The through holes also aid in maintaining registration of the chip(s) and the substrate. The through holes may be sized to establish a predetermined mechanical structure of solder joints formed by the solder balls when fused together. The preformed planar structure has a planar core and opposing planar faces.

Abstract: A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be applied to the preformed planar structure in order that flux is selectively applied to the solder balls (pads) on the chip and the substrate. The preformed planar structure may be provided with through holes in registration with the solder balls on the chip(s) and the substrate. In this case, liquid flux selectively fills the through holes for delivery to the solder balls during soldering. The through holes also aid in maintaining registration of the chip(s) and the substrate. The through holes may be sized to establish a predetermined mechanical structure of solder joints formed by the solder balls when fused together. The preformed planar structure has a planar core and opposing planar faces.

Abstract: A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be applied to the preformed planar structure in order that flux is selectively applied to the solder balls (pads) on the chip and the substrate. The preformed planar structure may be provided with through holes in registration with the solder balls on the chip(s) and the substrate. In this case, liquid flux selectively fills the through holes for delivery to the solder balls during soldering. The through holes also aid in maintaining registration of the chip(s) and the substrate. The through holes may be sized to establish a predetermined mechanical structure of solder joints formed by the solder balls when fused together. The preformed planar structure has a planar core and opposing planar faces.

Abstract: An integrated circuit (IC) chip package is formed by extending the overall dimensions of a standard IC on a semiconductor substrate, typically a first silicon wafer, to provide an integral band of semiconductor material therearound on which are formed a series of spaced IC chip input/output pad areas extending along the band. A bottom peripheral edge of a discrete cap of the same semiconductor material, e.g. silicon, is sealingly affixed around an inner periphery of the band inboard of the series of pad areas and outboard of the IC active circuit areas, so that the cap interior spacedly covers the active circuit area and the input/output pad areas are exposed. The caps may be made by photolithography and microetching techniques from a second semiconductor wafer of the same type as the IC wafer. Metallization extends on the first wafer from connect pads on the active circuit area to the extended and exposed input/output pad areas exterior of the cap. The IC may be probed for test purposes prior to capping.

Abstract: An improved package with J-leads for an integrated circuit is obtained by modifying the package profile so as to relieve the bottom edge to provide space for insertion of a rod to be used as a tool to shape or reshape the curved part of the leads. This permits both easier original manufacturing and faster and better reshaping of bent leads.