Abstract: Described are system and method embodiments for measuring a thickness of a material layer using electromagnetic radiation. In some embodiments, a system includes a radiation source configured to direct first radiation towards a first surface of a layer of material having a thickness between the first surface and a second surface opposite the first surface. The first radiation causes the material layer to emit secondary radiation. A filter is positioned between the material layer and a radiation detector and in the beam path of the second radiation in order to attenuate a portion of the second radiation associated with fluorescence of the material to emit third radiation. Then, the radiation detector is configured to detect the third radiation and a controller is configured to provide a measurement corresponding to the thickness of the material layer based on the detected third radiation.

Abstract: Described are system and method embodiments for measuring a thickness of a material layer using electromagnetic radiation. In some embodiments, a system includes a radiation source configured to direct first radiation towards a first surface of a layer of material having a thickness between the first surface and a second surface opposite the first surface. The first radiation causes the material layer to emit secondary radiation. A filter is positioned between the material layer and a radiation detector and in the beam path of the second radiation in order to attenuate a portion of the second radiation associated with fluorescence of the material to emit third radiation. Then, the radiation detector is configured to detect the third radiation and a controller is configured to provide a measurement corresponding to the thickness of the material layer based on the detected third radiation.