Patents by Inventor Vahid Safavi Ardebili

Vahid Safavi Ardebili has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230405924
    Abstract: A heated nozzle assembly for a three-dimensional printer includes a shank defining a feed end and a first internal flow passage, where the feed end is fluidly coupled to the first internal flow passage. The heated nozzle assembly also includes a shank barrel coupled to the shank that includes a second internal flow passage and a body portion. The second internal flow passage of the shank barrel is fluidly coupled to the first internal flow passage of the shank and the body portion of the shank barrel defines a plurality of heater segments that are disposed along the body portion of the shank barrel that are thermally isolated from one another. The heated nozzle assembly includes a plurality of heating elements that each correspond to one of the plurality of heater segments disposed along the length of the body portion of the shank barrel.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 21, 2023
    Inventors: Vahid Safavi-Ardebili, Jorge Arturo Mijares Tobias, Iris Gisey Euan Waldestrand, Kristian Oftebro, Chad Eichele
  • Patent number: 8651360
    Abstract: An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: February 18, 2014
    Assignee: Orthodyne Electronics Corporation
    Inventor: Vahid Safavi Ardebili
  • Publication number: 20130292456
    Abstract: An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.
    Type: Application
    Filed: January 12, 2012
    Publication date: November 7, 2013
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventor: Vahid Safavi Ardebili