Patents by Inventor Vahram S. Cardashian

Vahram S. Cardashian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple integrated circuit interconnection arrangement
    Patent number: 5126920
    Abstract: A flexible chip interconnection includes a flexible film having interconnection lines formed on opposite sides thereof, with selected of the interconnection lines from one side connected by through-film conductors to interconnection lines on the other side. Insulating layers cover both sets of interconnection lines. Multi-chip circuits can be formed on the film with the interconnection lines directly connecting the chips.
    Type: Grant
    Filed: September 23, 1991
    Date of Patent: June 30, 1992
    Assignee: Honeywell Inc.
    Inventors: Vahram S. Cardashian, Jerald M. Loy
  • Integrated circuit interconnector
    Patent number: 4933810
    Abstract: A flexible film has electrical interconnections on each side. Through-film interconnects pass through openings in the film to connect the electrical interconnects on opposite sides of the film. Electrical contact patterns are formed on one side of the film to accomodate integrated circuit chips or other small electronic devices. Multi-chip circuits can be formed by connecting the chips to the pattern areas and connecting the patterns by way of the electrical interconnections on either side, or on both sides.
    Type: Grant
    Filed: April 30, 1987
    Date of Patent: June 12, 1990
    Assignee: Honeywell Inc.
    Inventors: Vahram S. Cardashian, Jerald M. Loy, Frank S. Mills