Patents by Inventor Vaibhav Agrawal

Vaibhav Agrawal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220102242
    Abstract: Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled to a surface thereof. A dummy die, adjacent to an IC die and coupled to a region of the substrate, comprises a polymer resin and a filler. A package mold structure of the packaged device adjoins respective sides of the IC die and the dummy die, and adjoins the surface of the substrate. In another embodiment, a first CTE of the dummy die is less than a second CTE of the package mold structure, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the package mold structure.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 31, 2022
    Applicant: Intel Corporation
    Inventors: Mitul Modi, Joseph Van Nausdle, Omkar Karhade, Edvin Cetegen, Nicholas Haehn, Vaibhav Agrawal, Digvijay Raorane, Dingying Xu, Ziyin Lin, Yiqun Bai
  • Publication number: 20220102231
    Abstract: Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled thereto. A dummy die structure extends to a bottom of a recess structure formed by a first package mold structure on the substrate. The dummy die structure comprises a polymer resin and a filler, or comprises a metal which has a low coefficient of thermal expansion (CTE). A second package mold structure, which extends to the recess structure, is adjacent to the first package mold structure and to an IC die. In another embodiment, a first CTE of the dummy die is less than a second CTE of one of the package mold structures, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the one of the package mold structures.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 31, 2022
    Applicant: Intel Corporation
    Inventors: Mitul Modi, Joseph Van Nausdle, Omkar Karhade, Edvin Cetegen, Nicholas Haehn, Vaibhav Agrawal, Digvijay Raorane
  • Publication number: 20200179982
    Abstract: The present disclosure provides a sequencer device, communicatively coupled to a system, for arranging a plurality of shipments in order of delivery. The sequencer device includes a plurality of frames. Each of the plurality of frames includes a plurality of carrier plates. The sequencer device includes a loading mechanism. The sequencer device includes a plurality of support columns. The sequencer device includes a plurality of rotation modules. The sequencer device includes an unloading mechanism. The unloading mechanism unloads each of the plurality of shipments in order of delivery. The sequencer device receives sequence for sequencing the plurality of shipments from the system. The sequencer device enables physical sequencing of the plurality of shipments.
    Type: Application
    Filed: June 25, 2019
    Publication date: June 11, 2020
    Applicant: NTEX Transportation Services Pvt. Ltd.
    Inventors: Tanay SHAH, Pushkar OKE, Vaibhav AGRAWAL, Yogesh KULKARNI
  • Publication number: 20200184418
    Abstract: The present disclosure provides a computer-implemented method and system for sequencing of a plurality of shipments in order of delivery. The method includes a first step of receiving a first set of data, a second set of data and a third set of data at sequence determination system. The method includes another step of determining one or more routes with facilitation of the first set of data at the sequence determination system. The method includes yet another step of analyzing the second set of data and the third set of data at the sequence determination system. The method includes yet another step of optimizing a final route form the one or more routes at the sequence determination system. The method includes yet another step of enabling a delivery associate of the one or more delivery associate to edit and approve the final route.
    Type: Application
    Filed: June 25, 2019
    Publication date: June 11, 2020
    Applicant: NTEX Transportation Services Pvt. Ltd.
    Inventors: Tanay SHAH, Pushkar OKE, Vaibhav AGRAWAL, Yogesh KULKARNI
  • Patent number: 10636079
    Abstract: Techniques and system configurations for demand-based product sourcing in an electronic commerce setting is described herein. In one example, information about an item corresponding to a plurality of fulfillment locations is stored in a database. The information includes a plurality of transit times and a plurality of transit costs corresponding to each of the plurality of transit times. A subset of transit times is selected upon receiving a location of a user. A subset of transit costs corresponding with the subset of transit times is selected. An indication of a selection of a transit time is received. The indication includes the item, a quantity of the item, and a destination. A preferred fulfillment location of a subset of fulfillment locations is calculated, the calculating using the transit time, the location, and a selection rule, wherein the selection rule is generated using a plurality of selection attributes.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: April 28, 2020
    Assignee: BBY SOLUTIONS, INC.
    Inventors: Brent Shiely, Bradley R. McBeath, Trevis Williamson, Bradley K. Struble, Jeffrey D. Rathburn, Vaibhav Agrawal, Amy Williams, Pranab Koner, Vyas Mohan Mohan, Tanmay Sinha, David R. Leeder, Nicholas E. Oswald, Rick E. Allan, Rambabu Raipati
  • Publication number: 20170083967
    Abstract: Techniques and system configurations for demand-based product sourcing in an electronic commerce setting is described herein. In one example, information about an item corresponding to a plurality of fulfillment locations is stored in a database. The information includes a plurality of transit times and a plurality of transit costs corresponding to each of the plurality of transit times. A subset of transit times is selected upon receiving a location of a user. A subset of transit costs corresponding with the subset of transit times is selected. An indication of a selection of a transit time is received. The indication includes the item, a quantity of the item, and a destination. A preferred fulfillment location of a subset of fulfillment locations is calculated, the calculating using the transit time, the location, and a selection rule, wherein the selection rule is generated using a plurality of selection attributes.
    Type: Application
    Filed: September 18, 2015
    Publication date: March 23, 2017
    Inventors: Brent Shiely, Bradley R. McBeath, Trevis Williamson, Bradley K. Struble, Jeffrey D. Rathburn, Vaibhav Agrawal, Amy Williams, Pranab Koner, Vyas Mohan Mohan, Tanmay Sinha, David R. Leeder, Nicholas E. Oswald, Rick E. Allan, Rambabu Raipati
  • Publication number: 20160328781
    Abstract: Techniques and system configurations for order tracking and delivery fulfillment in an electronic commerce setting is described herein. In one example, a shipment that originates from a distribution center of a retailer is identified for delay (e.g., a delayed shipment in transit via a national carrier). The delayed shipment is replaced with a substitute shipment from inventory at an in-store location of the retailer. The substitute shipment is selected from an in-store location of the retailer based on proximity to the shipping destination, and is delivered via courier or agent to meet or precede a promised delivery date. The delayed shipment is then intercepted or redirected to the shipping source, the in-store location, or a distribution center. Related techniques for the management, processing, and tracking of data and information associated with substitute shipments are further described herein.
    Type: Application
    Filed: May 5, 2015
    Publication date: November 10, 2016
    Inventors: Sanu Patel-Zellinger, Julie Durham, Brian Flynn, Ryan Mendoza, Rick Patterson, Rob VanHout, Stephen Jakala, Charles Rooney, Vikas Jaiswal, Magesh Venkatesan, Raghu Venkateshwar, Asad Khan, Puneet Gupta, Vaibhav Agrawal, Eric Berens, Curtis Janicke