Patents by Inventor Vaibhav P. Trivedi

Vaibhav P. Trivedi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally coupling an integrated heat spreader to a heat sink base
    Publication number: 20080156457
    Abstract: The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.
    Type: Application
    Filed: March 12, 2008
    Publication date: July 3, 2008
    Inventors: Matthew J. Schaenzer, Thomas J. Fitzgerald, Tim A. Renfro, Manjit Dhindsa, Vaibhav P. Trivedi
  • Thermally coupling an integrated heat spreader to a heat sink base
    Patent number: 7364063
    Abstract: The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: April 29, 2008
    Assignee: Intel Corporation
    Inventors: Matthew J. Schaenzer, Thomas J. Fitzgerald, Tim A. Renfro, Manjit Dhindsa, Vaibhav P. Trivedi