Abstract: An integrated circuit (IC) having a selectively-designated electromagnetic compatibility (EMC) performance characteristic. The IC includes an IC die having an input or output (I/O) node. A first I/O cell of a first type associated with the I/O node provides a first EMC performance characteristic, and a second I/O cell of a second type associated with the I/O node provides a second EMC performance characteristic different from the first EMC performance characteristic. A first bonding pad is electrically coupled with the first I/O cell, and a second bonding pad is electrically coupled with the second I/O cell. The IC die can be packaged into a packaged IC having an I/O pin corresponding to the I/O node. The I/O pin is wired to one of either the first bonding pad or the second bonding pad, but not to the other, such that a pinout for the I/O node is preferentially provided having one of either the first EMC performance characteristic or the second EMC performance characteristic.

Abstract: An integrated circuit (IC) includes an output driver circuit portion that is electrically configurable, via a configuration input, to operate in either a first mode or a second mode corresponding to an indication of a condition of the IC, such as a supply voltage indication, the first mode and the second mode having different drive characteristics. A configuration interface circuit portion as part of the improved IC is adapted to selectively override the configuration input to configure operation of the output driver circuit portion in either the first mode or the second mode based on a drive strength control input, regardless of the condition of the IC.

Abstract: An integrated circuit (IC) having a selectively-designated electromagnetic compatibility (EMC) performance characteristic. The IC includes an IC die having an input or output (I/O) node. A first I/O cell of a first type associated with the I/O node provides a first EMC performance characteristic, and a second I/O cell of a second type associated with the I/O node provides a second EMC performance characteristic different from the first EMC performance characteristic. A first bonding pad is electrically coupled with the first I/O cell, and a second bonding pad is electrically coupled with the second I/O cell. The IC die can be packaged into a packaged IC having an I/O pin corresponding to the I/O node. The I/O pin is wired to one of either the first bonding pad or the second bonding pad, but not to the other, such that a pinout for the I/O node is preferentially provided having one of either the first EMC performance characteristic or the second EMC performance characteristic.

Abstract: An integrated circuit (IC) includes an output driver circuit portion that is electrically configurable, via a configuration input, to operate in either a first mode or a second mode corresponding to an indication of a condition of the IC, such as a supply voltage indication, the first mode and the second mode having different drive characteristics. A configuration interface circuit portion as part of the improved IC is adapted to selectively override the configuration input to configure operation of the output driver circuit portion in either the first mode or the second mode based on a drive strength control input, regardless of the condition of the IC.