Patents by Inventor Vaidyanthan Kripesh

Vaidyanthan Kripesh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090116207
    Abstract: A method for micro-component self-assembly is disclosed. An embodiment self-assembly method provides a substrate with an interconnect, and a micro-device having a corresponding interconnect that is arranged for engagement with the interconnect of the substrate during the self-assembly process. A method for fabricating a micro-device for micro-component self-assembly with a substrate and a method for fabricating a substrate for micro-component self-assembly with a micro-device are also disclosed.
    Type: Application
    Filed: November 5, 2007
    Publication date: May 7, 2009
    Inventors: Samuel Long Yak Lim, Yue Ying Ong, Liling Yan, Vaidyanthan Kripesh, Srinivasa Rao Vempati, Ebin Liao