Patents by Inventor Val Mandrusov

Val Mandrusov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic interference cable backshell assembly for high-density interconnect
    Patent number: 7485003
    Abstract: A cable connector assembly for high frequency applications having reduced electromagnetic emissions. Aspects include providing physical spacing and electrical isolation between the signal conductors and a conductive housing. An isolative member provides reduced capacitive coupling. One embodiment includes spring preloading of the electrical connector relative to the housing. One embodiment includes a connector floating longitudinally within a conductive housing.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: February 3, 2009
    Assignee: Silicon Graphics, Inc.
    Inventors: Val Mandrusov, Duane Friesen
  • Backshell assembly
    Patent number: 7124505
    Abstract: A cable connector backshell assembly for high frequency applications requiring reduced electromagnetic emissions. Aspects include providing sufficient physical spacing and electrical isolation between the signal conductors and the housing to meet EMI standards for HIPPI-6400 connector assemblies. One embodiment includes spring preloading of the electrical connector. One embodiment includes a longitudinally floating connector.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: October 24, 2006
    Assignee: Silicon Graphics, Inc.
    Inventors: Duane Friesen, Val Mandrusov
  • Electromagneric Interference cable backshell assembly for high-density interconnect
    Publication number: 20040048516
    Abstract: A cable connector assembly for high frequency applications having reduced electromagnetic emissions. Aspects include providing physical spacing and electrical isolation between the signal conductors and a conductive housing. An isolative member provides reduced capacitive coupling. One embodiment includes spring preloading of the electrical connecter relative to the housing. One embodiment includes a connector floating longitudinally within a conductive housing.
    Type: Application
    Filed: September 5, 2002
    Publication date: March 11, 2004
    Applicant: Silicon Graphics, Inc.
    Inventors: Val Mandrusov, Duane Friesen
  • Backshell assembly
    Publication number: 20020182925
    Abstract: A cable connector backshell assembly for high frequency applications requiring reduced electromagnetic emissions. Aspects include providing sufficient physical spacing and electrical isolation between the signal conductors and the housing to meet EMI standards for HIPPI-6400 connector assemblies. One embodiment includes spring preloading of the electrical connecter. One embodiment includes a longitudinally floating connector.
    Type: Application
    Filed: July 24, 2002
    Publication date: December 5, 2002
    Applicant: Silicon Graphics, Inc.
    Inventors: Duane Friesen, Val Mandrusov
  • Backshell assembly
    Publication number: 20020001989
    Abstract: A cable connector backshell assembly for high frequency applications requiring reduced electromagnetic emissions. Aspects include providing sufficient physical spacing and electrical isolation between the signal conductors and the housing to meet EMI standards for HIPPI-6400 connector assemblies. One embodiment includes spring preloading of the electrical connecter. One embodiment includes a longitudinally floating connector.
    Type: Application
    Filed: December 5, 2000
    Publication date: January 3, 2002
    Applicant: Silicon Graphics, Inc.
    Inventors: Duane Friesen, Val Mandrusov