Patents by Inventor Val R. Marinov

Val R. Marinov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS OF TRANSFERRING A DIE FROM A CARRIER TO A RECEIVE SUBSTRATE, AND RELATED SYSTEMS AND MATERIALS
    Publication number: 20230107245
    Abstract: A method of transferring a die from a carrier to a receive substrate is provided. The method includes the steps of: (a) supporting a die on a carrier, a transfer material being provided between the die and the carrier; (b) exposing the transfer material to light energy to form a bubble in the transfer material; and (c) transferring the die from the carrier to a receive substrate using the bubble, the die being in contact with the bubble when the die contacts the receive substrate.
    Type: Application
    Filed: September 21, 2022
    Publication date: April 6, 2023
    Inventor: Val R. Marinov
  • Selective laser-assisted transfer of discrete components
    Patent number: 9862141
    Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: January 9, 2018
    Assignee: NDSU RESEARCH FOUNDATION
    Inventors: Val R. Marinov, Orven Swenson, Mark Pavicic, Ross A. Miller, Zhigang Chen, Ferdous Sarwar, Matthew R. Semler
  • SELECTIVE LASER-ASSISTED TRANSFER OF DISCRETE COMPONENTS
    Publication number: 20170313044
    Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.
    Type: Application
    Filed: December 14, 2015
    Publication date: November 2, 2017
    Applicant: NDSU RESEARCH FOUNDATION
    Inventors: Val R. Marinov, Orven Swenson, Mark Pavicic, Ross A. Miller, Zhigang Chen, Ferdous Sarwar, Matthew R. Semler
  • SELECTIVE LASER-ASSISTED TRANSFER OF DISCRETE COMPONENTS
    Publication number: 20140238592
    Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.
    Type: Application
    Filed: October 4, 2013
    Publication date: August 28, 2014
    Applicant: NDSU RESEARCH FOUNDATION
    Inventors: Val R. Marinov, Orven Swenson, Mark Pavicic, Ross A. Miller, Zhigang Chen, Ferdous Sarwar, Matthew R. Semler