Patents by Inventor Valérie A. Oberson
Valérie A. Oberson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240113060Abstract: There is provided a solder bump structure comprising an under bump metallurgy (UBM) layer, a first solder portion over the UBM layer, the first solder portion having a first composition, a barrier layer encapsulating the first solder portion, and a second solder portion over the barrier layer, the second solder portion having a second composition different from the first composition.Type: ApplicationFiled: February 22, 2021Publication date: April 4, 2024Inventors: Abderrahim EL AMRANI, Etienne PARADIS, David DANOVITCH, Dominique DROUIN, Valerie OBERSON, Michel TURGEON, Clement FORTIN
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Patent number: 11177217Abstract: Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.Type: GrantFiled: January 9, 2020Date of Patent: November 16, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kamal K. Sikka, Jon A. Casey, Joshua Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin, Mark W. Kapfhammer, Steve Ostrander, Maryse Cournoyer, Valérie A. Oberson, Lawrence A. Clevenger
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Patent number: 10699972Abstract: A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.Type: GrantFiled: November 30, 2017Date of Patent: June 30, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie A. Oberson, David L. Questad
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Publication number: 20200144187Abstract: Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.Type: ApplicationFiled: January 9, 2020Publication date: May 7, 2020Inventors: Kamal K. Sikka, Jon A. Casey, Joshua Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin, Mark W. Kapfhammer, Steve Ostrander, Maryse Cournoyer, Valérie A. Oberson, Lawrence A. Clevenger
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Patent number: 10580738Abstract: Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.Type: GrantFiled: March 20, 2018Date of Patent: March 3, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kamal K. Sikka, Jon A. Casey, Joshua Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin, Mark W. Kapfhammer, Steve Ostrander, Maryse Cournoyer, Valérie A. Oberson, Lawrence A. Clevenger
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Publication number: 20190295952Abstract: Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.Type: ApplicationFiled: March 20, 2018Publication date: September 26, 2019Inventors: Kamal K. Sikka, Jon A. Casey, Joshua Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin, Mark W. Kapfhammer, Steve Ostrander, Maryse Cournoyer, Valérie A. Oberson, Lawrence A. Clevenger
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Publication number: 20180082912Abstract: A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.Type: ApplicationFiled: November 30, 2017Publication date: March 22, 2018Inventors: William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie A. Oberson, David L. Questad
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Patent number: 9899279Abstract: A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.Type: GrantFiled: October 17, 2014Date of Patent: February 20, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie A. Oberson, David L. Questad
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Patent number: 9815149Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.Type: GrantFiled: April 3, 2012Date of Patent: November 14, 2017Assignee: International Business Machines CorporationInventors: Kang-Wook Lee, Nathalie Normand, Valerie Oberson
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Patent number: 9808874Abstract: The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.Type: GrantFiled: September 13, 2012Date of Patent: November 7, 2017Assignee: International Business Machines CorporationInventors: Kang-Wook Lee, Jae-Woong Nah, Nathalie Normand, Valerie Oberson
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Patent number: 9579738Abstract: The present invention is directed to flux compositions. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups.Type: GrantFiled: February 25, 2011Date of Patent: February 28, 2017Assignee: International Business Machines CorporationInventors: Kang-Wook Lee, Jae-Woong Nah, Nathalie Normand, Valerie Oberson
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Publication number: 20150231721Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.Type: ApplicationFiled: April 30, 2015Publication date: August 20, 2015Inventors: Kang-Wook Lee, Nathalie Normand, Valerie Oberson
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Patent number: 8957531Abstract: A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.Type: GrantFiled: October 20, 2011Date of Patent: February 17, 2015Assignee: International Business Machines CorporationInventors: William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie A. Oberson, David L. Questad
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Publication number: 20150036716Abstract: A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.Type: ApplicationFiled: October 17, 2014Publication date: February 5, 2015Inventors: William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie A. Oberson, David L. Questad
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Patent number: 8444774Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.Type: GrantFiled: March 25, 2010Date of Patent: May 21, 2013Assignee: International Business Machines CorporationInventors: Eric Duschesne, Kang-Wook Lee, Valerie Oberson
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Publication number: 20130098176Abstract: A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.Type: ApplicationFiled: October 20, 2011Publication date: April 25, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie A. Oberson, David L. Questad
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Publication number: 20130001279Abstract: The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.Type: ApplicationFiled: September 13, 2012Publication date: January 3, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kang-Wook Lee, Jae-Woong Nah, Nathalie Normand, Valerie Oberson
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Patent number: 8268716Abstract: A method of coupling an integrated circuit to a substrate includes providing the substrate, forming a contact pad in the substrate, contacting the contact pad with a solder ball, and repeatedly exposing the solder ball to a thermal process to cause intermetallics based on a metal in the contact pad to be formed in the thermal ball.Type: GrantFiled: September 30, 2010Date of Patent: September 18, 2012Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Valerie Oberson, Srinivasa N. Reddy, Krystyna W. Semkow, Richard A. Shelleman, Kamalesh K. Srivistava
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Publication number: 20120217290Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.Type: ApplicationFiled: April 3, 2012Publication date: August 30, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kang-Wook Lee, Nathalie Normand, Valerie Oberson
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Publication number: 20120217289Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.Type: ApplicationFiled: February 25, 2011Publication date: August 30, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kang-Wook Lee, Jae-Woong Nah, Nathalie Normand, Valerie Oberson