Abstract: A double-sided cooling (DSC) semiconductor package is summarized as including a first assembly having a plurality of pillars that extend outward from a first heat sink or dissipation structure and at least one die that is pre-coupled to the first heat sink or dissipation structure. A second assembly includes a plurality of flanges that are pre-welded or pre-coupled to a second heat sink or dissipation structure. The first assembly and second assembly are pre-formed before being coupled together. After the first assembly and the second assembly have been formed, the first assembly is coupled to the second assembly. After the pre-formed stacked semiconductor assembly has been formed, a molding compound is applied to form the first embodiment of the double-sided cooling (DSC) semiconductor package or device.