Abstract: The present invention relates to a cooler (1) through which fluid can flow for cooling power electronics (200) comprising a first metal part (11), a second metal part (12), a cooling structure (14) and a reinforcing part (13). The first metal part (11) and the second metal part (12) are connected to each other and define a cooling channel (10) between them through which a fluid can flow. The first metal part (11) comprises a receiving area (110) for receiving the power electronics (200) to be cooled. The cooling structure (14) is located in the cooling channel (10) and connected to the first metal part (11) and the second metal part (12). The reinforcing part (13) is secured to the first metal part (11). Furthermore, the invention relates to a power electronics arrangement (1000) having a cooler (1) of this type and power electronics (200).

Abstract: The present invention relates to a method of connecting a cooler module (4) to a metal plate by a sintering process, wherein the cooler module (4) comprises a metallic housing (5) having a coolant inlet (7), a coolant outlet (8) and a first housing side (9), and within the housing (5) a coolant flow structure (6), and wherein the method comprises the steps of: introducing at least one glycol between the coolant flow structure (6), applying a sinter paste and sintering to join the metal plate and the first housing side (9) under pressure and temperature.

Abstract: For an electrical and/or electronic device, comprising at least one cooling device having a top side, an electrical and/or electronic assembly arranged on the top side of the cooling device having a contact surface, wherein the contact surface faces the top side of the cooling device and is attached to the top side of the cooling device by means of an intermediate layer arranged between the cooling device and the contact surface of the electrical and/or electronic assembly, it is proposed that a coating extending flat is arranged on the top side of the cooling device, wherein the coating on the top side of the cooling device comprises at least one recess, in which the top side of the cooling device is not coated, wherein the contact surface of the electrical and/or electronic assembly in the recess is in contact with the cooling device and attached to the cooling device.