Patents by Inventor Valentin YEPANECHNIKOV

Valentin YEPANECHNIKOV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optoelectronic packaging assemblies
    Patent number: 10014654
    Abstract: Optoelectronic packaging assemblies are provided that are useful for optical data, transfer In high performance computing applications, board to board in data centers, memory to CPU, switch/FPGA (field programmable gate array) for chip to chip interconnects, and memory extension. The packaging assemblies provide fine pitch flip chip interconnects and chip stacking assemblies with good thermo-mechanical reliability. Underfill dams and optical overhang regions and are provided for optical interconnection.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: July 3, 2018
    Assignee: Intel Corporation
    Inventors: Myung Jin Yim, Ansheng Liu, Valentin Yepanechnikov
  • OPTOELECTRONIC PACKAGING ASSEMBLIES
    Publication number: 20170005453
    Abstract: Optoelectronic packaging assemblies are provided that are useful for optical data, transfer In high performance computing applications, board to board in data centers, memory to CPU, switch/FPGA (field programmable gate array) for chip to chip interconnects, and memory extension. The packaging assemblies provide fine pitch flip chip interconnects and chip stacking assemblies with good thermo-mechanical reliability. Underfill dams and optical overhang regions and are provided for optical interconnection.
    Type: Application
    Filed: December 27, 2013
    Publication date: January 5, 2017
    Inventors: Myung Jin YIM, Ansheng LIU, Valentin YEPANECHNIKOV