Abstract: Film-forming formulations are provided that satisfy a plurality of criteria for inkjet printing, thermal printing, or both. Criteria for film-forming formulations are also provided for selecting vehicles, combinations of vehicles, and film-forming materials, based upon viscosity, surface tension, solubility, and properties of printed films formed by such formulations. Film-forming formulations useful in the fabrication of organic light emitting devices (OLEDs) are provided including formulations useful for the fabrication of OLED hole transport layers, hole injection layers, electron transport layers, electron injection layers, and emissive layers, of an OLED. Methods of evaluating formulations for suitability in inkjet printing, thermal printing, or both, are also provided.

Abstract: A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

Abstract: In one embodiment the disclosure relates to an apparatus for depositing an organic material on a substrate, including a source heater for heating organic particles to form suspended organic particles; a transport stream for delivering the suspended organic particles to a discharge nozzle, the discharge nozzle having a plurality of micro-pores, the micro-pores providing a conduit for passage of the suspended organic particles; and a nozzle heater for pulsatingly heating the micro-pores nozzle to discharge the suspended organic particles from the discharge nozzle.

Abstract: The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

Abstract: Embodiments of methods and apparatus for micro-printing films are disclosed. According to various embodiments, the printing apparatus includes printheads with ink-jets for dispensing droplets of ink formed from a carrier liquid and a print material. The printheads also include thermal-jets for depositing the print material onto a substrate from the droplets of ink dispensed by ink-jets. The droplets of ink dispensed by ink-jets flow into micro-structures on the thermal-jets and the thermal-jets are heated to evaporate the carrier liquid and to vaporize and direct the print material onto a substrate. The printing apparatus further includes a control unit that is configured to automatically adjust an output from one or more printheads based on one or more measured quantities.

Abstract: The disclosure relates to a method for loading ink material into discharge nozzle having a non-discharge surface and a plurality of micropores. The, method includes the steps of providing a quantity of liquid ink material defined by a carrier fluid containing dissolved or suspended film material; delivering the quantity of liquid ink onto the discharge nozzle and directing a portion of the delivered ink into at least one micropore; flowing a pressurized gas over the surface to drive the delivered ink material into the least one nozzle; evaporating the carrier fluid from the delivered ink to form a substantially carrier-free ink material at the micropore; and dispensing the substantially carrier-free ink material from the nozzle. The surface can be configured to reject the ink and the plurality of nozzles are configured to receive the ink.

Abstract: The disclosure generally relates to a method and apparatus for depositing a substantially solid film onto a substrate. The solid film can be an Organic Light-Emitting Diode (“OLED”). In one embodiment, the disclosure relates to using a material supply, a rotating or moving mechanism having at least one transfer surface which is supplied with film material in one orientation and delivers film material to the substrate at a second orientation such that film material delivered to the substrate deposits in substantially solid form. The delivery to the substrate can be performed without the transfer surface materially contacting the substrate. The film material can be deposited on the transfer surface in either solid form or in liquid form (e.g., as a mixture of carrier liquid and dissolved or suspended film material).

Abstract: In an embodiment, the disclosure relates to a method and apparatus for fault monitoring and controlling operation of a discharge nozzle in a large array of discharge nozzles. An exemplary apparatus includes a thin, thermally conductive membrane, with an integrated thin-film electrical heater. When a fixed voltage is applied to the heater, and as the heater heats, the resistance of the heater will increase which will cause a concomitant decrease in the electrical current flowing through the heater. By measuring the resistance of the heater it can readily be determined whether the device is functioning properly.