Patents by Inventor Valerie Uzzell

Valerie Uzzell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11846580
    Abstract: A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: December 19, 2023
    Assignees: Illumina, Inc., Illumina Cambridge Limited
    Inventors: James Tsay, Anmiv Prabhu, David Heiner, Edwin Li, Alexandre Richez, John M. Beierle, Kevan Samiee, Kristina Munoz, Leonid Malevanchik, Ludovic Vincent, Naiqian Zhan, Peyton Shieh, Robert Yang, Samantha Schmitt, Sang Park, Scott Bailey, Sean M. Ramirez, Sunmin Ahn, Valerie Uzzell, Wei Wei, Yuxiang Huang, Tyler Jamison Dill
  • Publication number: 20210208055
    Abstract: A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.
    Type: Application
    Filed: March 3, 2021
    Publication date: July 8, 2021
    Inventors: James Tsay, Anmiv Prabhu, David Heiner, Edwin Li, Alexandre Richez, John M. Beierle, Kevan Samiee, Kristina Munoz, Leonid Malevanchik, Ludovic Vincent, Naiqian Zhan, Peyton Shieh, Robert Yang, Samantha Schmitt, Sang Park, Scott Bailey, Sean M. Ramirez, Sunmin Ahn, Valerie Uzzell, Wei Wei, Yuxiang Huang, Tyler Jamison Dill
  • Patent number: 10955332
    Abstract: A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: March 23, 2021
    Assignees: Illumina, Inc., Illumina Cambridge Limited
    Inventors: James Tsay, Anmiv Prabhu, David Heiner, Edwin Li, Alexandre Richez, John M. Beierle, Kevan Samiee, Kristina Munoz, Leonid Malevanchik, Ludovic Vincent, Naiqian Zhan, Peyton Shieh, Robert Yang, Samantha Schmitt, Sang Park, Scott Bailey, Sean M. Ramirez, Sunmin Ahn, Valerie Uzzell, Wei Wei, Yuxiang Huang, Tyler Jamison Dill
  • Publication number: 20180195950
    Abstract: A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.
    Type: Application
    Filed: December 20, 2017
    Publication date: July 12, 2018
    Inventors: James Tsay, Anmiv Prabhu, David Heiner, Edwin Li, Alexandre Richez, John M. Beierle, Kevan Samiee, Kristina Munoz, Leonid Malevanchik, Ludovic Vincent, Naiqian Zhan, Peyton Shieh, Robert Yang, Samantha Schmitt, Sang Park, Scott Bailey, Sean M. Ramirez, Sunmin Ahn, Valerie Uzzell, Wei Wei, Yuxiang Huang, Tyler Jamison Dill