Abstract: Heat transfer systems are presented with improved heat dissipation schemes based upon an asymmetric arrangement of Peltier elements to form a hot side of greater area than the cold side. This permits greater heat dissipation at the hot side of the heat transfer device into a suitable heat sink. A substantially planar system of radial symmetry is the basis of a highly efficient heat spreading scheme. The ‘spokes’ of the system are pie-wedge shaped Peltier semiconductor elements having a small heat transfer junction at one end and large heat transfer junction at the other. In best versions, a concentric ring scheme has a cooled area at the center and a heat dump at the periphery. Semiconductor Peltier elements connect the two and provide a vehicle to carry heat radially away from a heat point source thermally coupled to the heat transfer system at an active area. These special arrangements are provided while still maintaining the necessary serial electronic circuit and parallel thermal circuit.

Abstract: New Peltier semiconductor heat transfer systems are presented herein. In particular, Peltier heat transfer systems of Peltier semiconductor elements of highly unique shape are arranged to bias the cooling side with respect to its size and consequently performance. In effect, a Peltier heat transfer system is created whereby the Peltier called side is greatly reduced in size and the Peltier hot side is greatly expanded in size. Such ‘high aspect ratio’ Peltier systems promote ‘focused’ cooling effect, which is particularly useful in conjunction with high-performance electronic devices having a small footprint. The entire cooling a fact of the Peltier device is brought to the small space approximated by a point. Thus a ‘point’ heat source such as a semiconductor laser are high-performance light emitting diode is more effectively cooled by these systems.