Patents by Inventor Valivann Seangly

Valivann Seangly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EARPHONE WITH SOLID BODY
    Publication number: 20230292028
    Abstract: In an embodiment, an earphone having a solid earphone body is provided. A first mounting recess is formed in a first end of the earphone body. A first acoustic driver is disposed in the first mounting recess. At least a first sound bore is formed in the solid earphone body. The at least a first sound bore fluidly communicates with the first mounting recess and a first exit port formed at a second end of the earphone body. The second end of the earphone body is configured to be placed in an ear canal of a user. The earphone can be fabricated by a method that includes defining negative spaces for the first acoustic driver and the at least a first sound bore in a virtual model of the earphone body.
    Type: Application
    Filed: May 17, 2023
    Publication date: September 14, 2023
    Applicant: Audiolineout LLC
    Inventors: Valivann Seangly, Ben Loeliger, Kenneth Ball, Caleb Rosenau
  • EARPHONE
    Publication number: 20230254623
    Abstract: Innovations for an improved earphone design are provided. The earphone includes an earphone body with three or more acoustic drivers disposed substantially congruently about an axis. One or more acoustic drivers included in the earphone body include a first, sound emitting, end and a second opposing end. A vent is defined in a compartment in which the acoustic driver is received and is coaxial to an axis passing through the first and second ends of the acoustic driver.
    Type: Application
    Filed: February 7, 2022
    Publication date: August 10, 2023
    Applicant: Audiolineout LLC
    Inventors: Ben Loeliger, Valivann Seangly, Caleb Rosenau, Kenneth Ball
  • Earphone with solid body
    Patent number: 11659312
    Abstract: In an embodiment, an earphone having a solid earphone body is provided. A first mounting recess is formed in a first end of the earphone body. A first acoustic driver is disposed in the first mounting recess. At least a first sound bore is formed in the solid earphone body. The at least a first sound bore fluidly communicates with the first mounting recess and a first exit port formed at a second end of the earphone body. The second end of the earphone body is configured to be placed in an ear canal of a user. The earphone can be fabricated by a method that includes defining negative spaces for the first acoustic driver and the at least a first sound bore in a virtual model of the earphone body.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: May 23, 2023
    Assignee: Audiolineout LLC
    Inventors: Valivann Seangly, Ben Loeliger, Kenneth Ball, Caleb Rosenau
  • EARPHONE WITH SOLID BODY
    Publication number: 20220417634
    Abstract: In an embodiment, an earphone having a solid earphone body is provided. A first mounting recess is formed in a first end of the earphone body. A first acoustic driver is disposed in the first mounting recess. At least a first sound bore is formed in the solid earphone body. The at least a first sound bore fluidly communicates with the first mounting recess and a first exit port formed at a second end of the earphone body. The second end of the earphone body is configured to be placed in an ear canal of a user. The earphone can be fabricated by a method that includes defining negative spaces for the first acoustic driver and the at least a first sound bore in a virtual model of the earphone body.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 29, 2022
    Applicant: Audiolineout LLC
    Inventors: Valivann Seangly, Ben Loeliger, Kenneth Ball, Caleb Rosenau
  • EARPHONE WITH SOLID BODY
    Publication number: 20210044879
    Abstract: In an embodiment, an earphone having a solid earphone body is provided. A first mounting recess is formed in a first end of the earphone body. A first acoustic driver is disposed in the first mounting recess. At least a first sound bore is formed in the solid earphone body. The at least a first sound bore fluidly communicates with the first mounting recess and a first exit port formed at a second end of the earphone body. The second end of the earphone body is configured to be placed in an ear canal of a user. The earphone can be fabricated by a method that includes defining negative spaces for the first acoustic driver and the at least a first sound bore in a virtual model of the earphone body.
    Type: Application
    Filed: August 5, 2019
    Publication date: February 11, 2021
    Applicant: Audiolineout LLC
    Inventors: Valivann Seangly, Ben Loeliger, Kenneth Ball, Caleb Rosenau
  • Pair of earphones
    Patent number: D1025007
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: April 30, 2024
    Assignee: Audiolineout LLC
    Inventors: Valivann Seangly, Ben Loeliger, Kenneth Ball, Caleb Rosenau