Patents by Inventor Vall F. McClean

Vall F. McClean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Intermetallic diffusion block device and method of manufacture
    Patent number: 7683493
    Abstract: One embodiment of the present invention is directed to an under bump metallurgy material. The under bump metallurgy material of this embodiment includes an adhesion layer and a conduction layer formed on top of the adhesion layer. The under bump metallurgy material of this embodiment also includes a barrier layer plated on top of the conduction layer and a sacrificial layer plated on top of the barrier layer. The conduction layer of this embodiment includes a trench formed therein, the trench contacting a portion of the barrier layer and blocking a path of intermetallic formation between the conduction layer and the sacrificial layer.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: March 23, 2010
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, Carla A. Bailey, Harry D. Cox, Hua Gan, Hsichang Liu, Arthur G. Merryman, Vall F. McClean, Srinivasa S. N. Reddy, Brian R. Sundlof
  • INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE
    Publication number: 20090267228
    Abstract: One embodiment of the present invention is directed to an under bump metallurgy material. The under bump metallurgy material of this embodiment includes an adhesion layer and a conduction layer formed on top of the adhesion layer. The under bump metallurgy material of this embodiment also includes a barrier layer plated on top of the conduction layer and a sacrificial layer plated on top of the barrier layer. The conduction layer of this embodiment includes a trench formed therein, the trench contacting a portion of the barrier layer and blocking a path of intermetallic formation between the conduction layer and the sacrificial layer.
    Type: Application
    Filed: April 29, 2008
    Publication date: October 29, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Charles L. Arvin, Carla A. Bailey, Harry D. Cox, Hua Gan, Hsichang Liu, Arthur G. Merryman, Vall F. McClean, Srinivasa S. N. Reddy, Brian R. Sundlof