Patents by Inventor Valluri Bob Rao

Valluri Bob Rao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die with integrated microphone device using through-silicon vias (TSVs)
    Patent number: 10455308
    Abstract: Embodiments of the present disclosure describe a die with integrated microphone device using through-silicon vias (TSVs) and associated techniques and configurations. In one embodiment, an apparatus includes an apparatus comprising a semiconductor substrate having a first side and a second side disposed opposite to the first side, an interconnect layer formed on the first side of the semiconductor substrate, a through-silicon via (TSV) formed through the semiconductor substrate and configured to route electrical signals between the first side of the semiconductor substrate and the second side of the semiconductor substrate, and a microphone device formed on the second side of the semiconductor substrate and electrically coupled with the TSV. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventors: Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Valluri Bob Rao, Tor Lund-Larsen, Nicholas P. Cowley
  • DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs)
    Publication number: 20170245035
    Abstract: Embodiments of the present disclosure describe a die with integrated microphone device using through-silicon vias (TSVs) and associated techniques and configurations. In one embodiment, an apparatus includes an apparatus comprising a semiconductor substrate having a first side and a second side disposed opposite to the first side, an interconnect layer formed on the first side of the semiconductor substrate, a through-silicon via (TSV) formed through the semiconductor substrate and configured to route electrical signals between the first side of the semiconductor substrate and the second side of the semiconductor substrate, and a microphone device formed on the second side of the semiconductor substrate and electrically coupled with the TSV. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 17, 2014
    Publication date: August 24, 2017
    Applicant: Intel Corporation
    Inventors: Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Valluri Bob Rao, Tor Lund-Larsen, Nicholas P. Cowley