Patents by Inventor Valod Noshadi
Valod Noshadi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10366939Abstract: A system for mounting a heat sink to a printed circuit board includes a frame that is configured to be mounted to a printed circuit board and to receive a heat sink. The heat sink and the frame are formed as separate components. The frame is formed as a rigid component. The system further includes fastening elements that are configured to fix the heat sink to the frame in a mounting position after the heat sink has been inserted into the frame.Type: GrantFiled: October 18, 2017Date of Patent: July 30, 2019Assignee: Harman Becker Automotive Systems GmbHInventors: Valod Noshadi, Herbert Kronenwett
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Patent number: 10278313Abstract: The present disclosure relates to electronic devices and configurations. In one embodiment, an electronic device includes a plurality of circuit boards and a plurality of chassis enclosures. Each of the plurality of circuit boards is separately housed by a chassis enclosure. Each chassis enclosure includes a front housing and a back housing, the front housing and back housing configured to retain a circuit board, and at least one heat dissipation element. The plurality of chassis enclosures are mounted to provide an air gap for heat dissipation between each chassis enclosures. Each chassis enclosure electrically shields a retained circuit board.Type: GrantFiled: September 25, 2017Date of Patent: April 30, 2019Assignee: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATEDInventors: David Jia, Valod Noshadi, Homero Garza, Alex Tzinares
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Publication number: 20190098800Abstract: The present disclosure relates to electronic devices and configurations. In one embodiment, an electronic device includes a plurality of circuit boards and a plurality of chassis enclosures. Each of the plurality of circuit boards is separately housed by a chassis enclosure. Each chassis enclosure includes a front housing and a back housing, the front housing and back housing configured to retain a circuit board, and at least one heat dissipation element. The plurality of chassis enclosures are mounted to provide an air gap for heat dissipation between each chassis enclosures. Each chassis enclosure electrically shields a retained circuit board.Type: ApplicationFiled: September 25, 2017Publication date: March 28, 2019Applicant: Harman International Industries, IncorporatedInventors: David JIA, Valod NOSHADI, Homero GARZA, Alex TZINARES
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Publication number: 20180114742Abstract: A system for mounting a heat sink to a printed circuit board includes a frame that is configured to be mounted to a printed circuit board and to receive a heat sink. The heat sink and the frame are formed as separate components. The frame is formed as a rigid component.Type: ApplicationFiled: October 18, 2017Publication date: April 26, 2018Applicant: Harman Becker Automotive Systems GmbHInventors: Valod NOSHADI, Herbert KRONENWETT
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Patent number: 9907181Abstract: An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.Type: GrantFiled: July 3, 2014Date of Patent: February 27, 2018Assignee: Harman Becker Automotive Systems GmbHInventors: Guenther Kraft, Krunoslac Orcic, Didier Berthomier, Thomas Schiemann, Valod Noshadi
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Patent number: 9516790Abstract: A circuit board is provided that includes at least one Peltier heat pump device with at least one pair of semiconductor members arranged thermally in parallel and electrically in series. The at least one pair of semiconductor members is at least partially embedded in the circuit board.Type: GrantFiled: April 8, 2014Date of Patent: December 6, 2016Assignee: Harman Becker Automotive Systems GmbHInventor: Valod Noshadi
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Publication number: 20160174382Abstract: An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.Type: ApplicationFiled: July 3, 2014Publication date: June 16, 2016Inventors: Guenther KRAFT, Krunoslac ORCIC, Didier BERTHOMIER, Thomas SCHIEMANN, Valod NOSHADI
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Patent number: 9195055Abstract: An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer.Type: GrantFiled: February 5, 2014Date of Patent: November 24, 2015Assignee: HARMAN BECKER AUTOMOTIVE SYSTEMS GMBHInventors: Wieland Oberst, Guenther Kraft, Valod Noshadi, Michael Huonker, Kelei Shen
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Publication number: 20140298825Abstract: A circuit board is provided that includes at least one Peltier heat pump device with at least one pair of semiconductor members arranged thermally in parallel and electrically in series. The at least one pair of semiconductor members is at least partially embedded in the circuit board.Type: ApplicationFiled: April 8, 2014Publication date: October 9, 2014Applicant: Harman Becker Automotive Systems GmbHInventor: Valod NOSHADI
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Publication number: 20140233086Abstract: An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer.Type: ApplicationFiled: February 5, 2014Publication date: August 21, 2014Applicant: HARMAN BECKER AUTOMOTIVE SYSTEMS GMBHInventors: Wieland OBERST, Guenther KRAFT, Valod NOSHADI, Michael HUONKER, Kelei SHEN
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Patent number: 8085538Abstract: A fluid-cooled electronic housing assembly (“FCEHA”) configured for mounting within a vehicle is described. The FCEHA may be part of a fluid-cooled electronic system (“FCES”) that includes the FCEHA and a plurality of electronic components. The FCEHA is capable of providing effective cooling for the FCES while maintaining a small space requirement by utilizing a fluid cooling system that cools the housing of FCEHA. In general, the FCEHA includes a cooling-fluid channel through a heat sink that, in operation, allows a cooling fluid/liquid to flow throw the cooling-fluid channel and cool off the FCEHA more efficiently that air convection because the cooling fluid is more efficient in heat transport.Type: GrantFiled: October 23, 2009Date of Patent: December 27, 2011Assignee: Haman Becker Automotive Systems GmbHInventors: Valod Noshadi, Juri Woinkoff
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Publication number: 20100195285Abstract: A fluid-cooled electronic housing assembly (“FCEHA”) configured for mounting within a vehicle is described. The FCEHA may be part of a fluid-cooled electronic system (“FCES”) that includes the FCEHA and a plurality of electronic components. The FCEHA is capable of providing effective cooling for the FCES while maintaining a small space requirement by utilizing a fluid cooling system that cools the housing of FCEHA. In general, the FCEHA includes a cooling-fluid channel through a heat sink that, in operation, allows a cooling fluid/liquid to flow throw the cooling-fluid channel and cool off the FCEHA more efficiently that air convection because the cooling fluid is more efficient in heat transport.Type: ApplicationFiled: October 23, 2009Publication date: August 5, 2010Applicant: Harman Becker Automotive System GmbHInventors: Valod Noshadi, Juri Woinkoff