Abstract: The present disclosure pertains to a wafer box for transporting semiconductor wafers, typically in a coin stack configuration. The wafer box includes an outer box and at least one inner box. The semiconductor wafers are placed in the inner box or boxes, typically with appropriate separators and interleaves. The outer box includes a tray portion and a lid portion. The tray portion includes posts rising from its floor which are received by sleeves in the inner box. Shock absorbing rings are placed on the posts both above and below the inner box or boxes in order to provide protection against vertical shocks. Moreover, the outer box includes radially pivoting latching elements with padded bumper elements. These padded bumper elements are brought to an upright position to urge against the inner box or boxes in order to provide horizontal or lateral shock protection.

Abstract: The semiconductor wafer containment device or wafer box includes a base with a planar floor and a double concentric cylindrical wall structure arising therefrom. The double concentric cylindrical wall structure includes slots through which latch elements pivot radially. The latch elements include an inward padded spacer element. The latch elements pivot between an outward position wherein the padded spacer elements are relatively away from the wafer containment space and an inward upright position wherein the padded spacer elements impinge into the wafer containment space and are urged against the semiconductor wafers therein. Ramps on the lid capture the latch elements in the outward position and urge the latch elements to pivot to the inward upright position and be detent engaged in this position by slots formed on the lid.

Abstract: An adjustable height wafer box for the transportation of coin-stacked semiconductor wafers is disclosed. The adjustable height wafer box comprises a base plate, a cover plate, a plurality of ring insert plates and elastomer bumpers. The ring insert plates are stacked so as to successively engage one another, as well as engaging the base plate and the cover plate. The elastomer bumpers are engaged between successive ring insert plates and extend inwardly into the wafer containment space. The number of ring insert plates can be chosen to adjust the height of the wafer box in accordance with the number of coin-stacked semiconductor wafers to be shipped.

Abstract: A cushion-like device is provided for the transportation of semiconductor wafers. The device includes an interior formed from polyethylene closed cell foam that utilizes a foaming agent that imparts minimal alkanes and cations into the polyethylene foam material. An electrostatic discharge dissipative polyethylene film surrounds the foam interior and is joined thereto by hot melt EVA material. An array of apertures of approximately 0.010 inch diameter and less than 0.25 inch spacing is formed in the film to allow the foam to compress upon impact.