Abstract: A contact assembly for a testing system for testing integrated circuit devices is disclosed. The contact assembly includes a first blade, a second blade, and an elastomer configured to retain the first blade and the second blade. The first blade and the second blade are electrically conductive. The first blade and the second blade are arranged in a cross configuration so that the first blade and the second blade form a substantially X-shape when assembled. The elastomer is at least columnar in part and non-conductive.

Abstract: A contact assembly for a Kelvin testing system for testing integrated circuit devices is disclosed. The contact assembly includes at least one grouping of blades including a first force blade, a second force blade, a first sense blade, and a second sense blade; an electrical insulation layer disposed between the first force blade and the first sense blade and between the second force blade and the second sense blade; and an elongated elastomer. The elastomer is configured to be retained by the first force blade, the second force blade, the first sense blade, and the second sense blade. Each of the first force blade, the second force blade, the first sense blade, and the second sense blade includes a recess having an opening and sized to receive and retain at least a portion of the elastomer.

Abstract: A compliant ground block for a testing system for testing integrated circuit devices is disclosed. The compliant ground block includes a plurality of electrically conductive blades in a side by side generally parallel relationship. The blades are configured to be longitudinally slidable with respect to each other. The block also includes an elastomer configured to retain the plurality of blades. Each blade of the plurality of blades includes a first end and a second end opposite to the first end in the longitudinal direction. The plurality of blades is arranged so that the first end of each blade of the plurality of blades is opposite to the first end of an adjacent blade in the longitudinal direction so that the first end of one blade is adjacent the second end of the adjacent blade. The elastomer is at least tubular (e.g., hollow or solid cylindrical) in part and non-conductive.

Abstract: A spring probe assembly for a Kelvin testing system for testing integrated circuit devices is disclosed. The assembly includes a force spring probe and a sense spring probe. Each of the force spring probe and the sense spring probe includes a head; a body containing at least one resilient element; and a bottom. The body has a cylindrical shape, and the head and the body have a same diameter in an end view. The head includes a base and a top integrated with the base. The base has a cylindrical shape. The head includes a shoulder between the base and the top. The top includes an apex. The force spring probe and the sense spring probe are disposed so that the apexes of the force spring probe and the sense spring probe are adjacent to each other.

Abstract: A compliant ground block for a testing system for testing integrated circuit devices is disclosed. The compliant ground block includes a plurality of electrically conductive blades in a side by side generally parallel relationship. The blades are configured to be longitudinally slidable with respect to each other. The block also includes an elastomer configured to retain the plurality of blades. Each blade of the plurality of blades includes a first end and a second end opposite to the first end in the longitudinal direction. The plurality of blades is arranged so that the first end of each blade of the plurality of blades is opposite to the first end of an adjacent blade in the longitudinal direction so that the first end of one blade is adjacent the second end of the adjacent blade. The elastomer is at least tubular (e.g., hollow or solid cylindrical) in part and non-conductive.

Abstract: A test probe for use with a testing apparatus. The test probe includes a first portion, a second portion, and a third portion, with hinges between the first and second portions and the second and third portions. The first portion folded at the first hinge over the second portion, the third portion folded at the second hinge over the second portion, where the second portion is stacked between the first portion and the third portion. The test probe is compressible from a first uncompressed state to a second compressed state.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8-12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2-4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.

Abstract: A test probe for use with a testing apparatus. The test probe includes a first portion, a second portion, and a third portion, with hinges between the first and second portions and the second and third portions. The first portion folded at the first hinge over the second portion, the third portion folded at the second hinge over the second portion, where the second portion is stacked between the first portion and the third portion. The test probe is compressible from a first uncompressed state to a second compressed state.

Abstract: A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8-12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2-4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.

Abstract: A test socket with a link and mount system is used to couple a device under test to a testing apparatus for quick and reliable testing of microchips post-production. The socket includes a pivoting link that connects to the DUT, an elastomer for biasing the link in a first preferred orientation, and a mount that operates as a fulcrum to rotate the link into engagement with the DUT. The mount includes projections that extend below a bottom surface of the socket, such that engagement of the mount with the test device at the projections translates the mount parallel to a diagonal support wall in the socket such that the mount is driven away from the bottom surface of the socket and also toward the elastomer. The socket includes a gap above the mount to allow for movement of the mount within the socket, eliminating the fixed arrangement and the non-compliant loads that accompany the engagement of the mount to the test apparatus.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A test socket with a link and mount system is used to couple a device under test to a testing apparatus for quick and reliable testing of microchips post-production. The socket includes a pivoting link that connects to the DUT, an elastomer for biasing the link in a first preferred orientation, and a mount that operates as a fulcrum to rotate the link into engagement with the DUT. The mount includes projections that extend below a bottom surface of the socket, such that engagement of the mount with the test device at the projections translates the mount parallel to a diagonal support wall in the socket such that the mount is driven away from the bottom surface of the socket and also toward the elastomer. The socket includes a gap above the mount to allow for movement of the mount within the socket, eliminating the fixed arrangement and the non-compliant loads that accompany the engagement of the mount to the test apparatus.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring.

Abstract: A spring contact assembly having a first plunger with a tail portion having a flat contact surface and a second plunger having a tail portion with a flat contact surface wherein the flat contact surfaces are overlapping and are surrounded by an external compression spring such that the sliding engagement of the flat surfaces increases during compression of the spring.