Patents by Inventor Vamshi GANGUMALLA

Vamshi GANGUMALLA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12252395
    Abstract: Described herein are methods and systems for controlling a sensor assembly with a plurality of same type sensors. Sensors are operated in active and inactive states. The activation state of at least one of the sensors is changed based on an operational parameter that relates to an environmental condition differentially affecting the plurality of same type sensors.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: March 18, 2025
    Inventors: Vamshi Gangumalla, Uday Mudoi, Karthik Katingari, Mahdi Heydari
  • Publication number: 20230110372
    Abstract: Described herein are methods and systems for controlling a sensor assembly with a plurality of same type sensors. Sensors are operated in active and inactive states. The activation state of at least one of the sensors is changed based on an operational parameter that relates to an environmental condition differentially affecting the plurality of same type sensors.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 13, 2023
    Inventors: Vamshi Gangumalla, Uday Mudoi, Karthik Katingari, Mahdi Heydari
  • Patent number: 11566899
    Abstract: Described herein are methods and systems for configuring a motion sensor assembly to compensate for a temperature gradient. First and second sensors of the same type are arranged as opposing pairs with respect to a first axis that may be defined by a temperature gradient caused by at least one thermal element. Combining the output measurements of the first sensor and the second sensor allows effects of the temperature gradient on sensor measurements of the first sensor and the second sensor to be compensated.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: January 31, 2023
    Inventors: Karthik Katingari, Jongwoo Shin, Joe Seeger, Vamshi Gangumalla, Ardalan Heshmati, Sheena Shi
  • Patent number: 11006550
    Abstract: A circuit board cooling system includes a circuit board with a processor disposed thereon, a cooling unit operating according to an operating configuration to generate air flow to cool a portion of the circuit board, and a plurality of pressure sensors that are coupled with a sensor processing unit and configured to measure air pressure data at their respective locations. The pressure sensors include a first pressure sensor located between the processor and the cooling unit and a second pressure sensor located such that the processor is between the second pressure sensor and the cooling unit. Air pressure data measured by the plurality of pressure sensors is obtained by the sensor processing unit. The sensor processing unit compares the obtained air pressure data to reference air pressure data for the operating configuration and, based on the comparison, determines that a disturbance to the air flow exists.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: May 11, 2021
    Assignee: InvenSense, Inc.
    Inventors: Sankalp Dayal, Vamshi Gangumalla, Zaryab Hamavand, Calin Miclaus
  • Patent number: 10893628
    Abstract: A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: January 12, 2021
    Assignee: InvenSense, Inc.
    Inventors: Sankalp Dayal, Vamshi Gangumalla, Zaryab Hamavand, Calin Miclaus
  • Publication number: 20200348134
    Abstract: Described herein are methods and systems for configuring a motion sensor assembly to compensate for a temperature gradient. First and second sensors of the same type are arranged as opposing pairs with respect to a first axis that may be defined by a temperature gradient caused by at least one thermal element. Combining the output measurements of the first sensor and the second sensor allows effects of the temperature gradient on sensor measurements of the first sensor and the second sensor to be compensated.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 5, 2020
    Applicant: InvenSense, Inc.
    Inventors: Karthik Katingari, Jongwoo Shin, Joe Seeger, Vamshi Gangumalla, Ardalan Heshmati, Sheena Shi
  • Patent number: 10593176
    Abstract: A security system for a building comprises a pressure sensor and a computer system communicatively coupled with the pressure system. The pressure sensor coupled to a movable portion of a window in the building. The computer system is configured to: receive a first pressure measurement from the pressure sensor; compare the first pressure measurement to a reference pressure measurement; and based on the comparison, detect that the movable portion of the window has moved.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: March 17, 2020
    Assignee: InvenSense, Inc.
    Inventors: Vamshi Gangumalla, Sankalp Dayal, Calin Miclaus, Karthik Katingari, Rob Dick, Paul Schreier
  • Publication number: 20190150316
    Abstract: A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.
    Type: Application
    Filed: January 11, 2019
    Publication date: May 16, 2019
    Applicant: InvenSense, Inc.
    Inventors: Sankalp DAYAL, Vamshi GANGUMALLA, Zaryab HAMAVAND, Calin MICLAUS
  • Publication number: 20190124795
    Abstract: A circuit board cooling system comprises a circuit board, a processor disposed on the circuit board, a cooling unit operating according to an operating configuration to generate air flow to cool a portion of the circuit board, a plurality of pressure sensors configured to measure air pressure data at their respective locations, and a sensor processing unit coupled with the plurality of pressure sensors. The plurality of pressure sensors comprises a first pressure sensor located between the processor and the cooling unit and a second pressure sensor located such that the processor is between the second pressure sensor and the cooling unit. The sensor processing unit: obtains the air pressure data measured by the plurality of pressure sensors; compares the obtained air pressure data to reference air pressure data for the operating configuration; and based on the comparison, determines that a disturbance to the air flow exists.
    Type: Application
    Filed: August 17, 2018
    Publication date: April 25, 2019
    Applicant: InvenSense, Inc.
    Inventors: Sankalp DAYAL, Vamshi GANGUMALLA, Zaryab HAMAVAND, Calin MICLAUS
  • Publication number: 20190088098
    Abstract: A security system for a building comprises a pressure sensor and a computer system communicatively coupled with the pressure system. The pressure sensor coupled to a movable portion of a window in the building. The computer system is configured to: receive a first pressure measurement from the pressure sensor; compare the first pressure measurement to a reference pressure measurement; and based on the comparison, detect that the movable portion of the window has moved.
    Type: Application
    Filed: November 14, 2018
    Publication date: March 21, 2019
    Applicant: InvenSense, Inc.
    Inventors: Vamshi GANGUMALLA, Sankalp DAYAL, Calin MICLAUS, Karthik KATINGARI, Rob DICK, Paul SCHREIER