Patents by Inventor Van Son Nguyen
Van Son Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240309166Abstract: An exemplary embodiment of the present disclosure provides a method for depolymerizing a polymer product. The method comprises forming a reaction mixture by combining polymer feedstock with an activating agent and producing an oxidized polymer comprising one or more functional groups comprising an oxygen atom. Also described are systems comprising a vessel having one or more inert or chemically reactive grinding bodies, polymer feedstock, and an activating agent, wherein the system is configured to mix the one or more grinding bodies, the polymer feedstock, and activating agent under approximately ambient pressure.Type: ApplicationFiled: August 1, 2023Publication date: September 19, 2024Inventors: Carsten Sievers, Yuchen Chang, Van Son Nguyen
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Patent number: 11310903Abstract: A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.Type: GrantFiled: December 21, 2020Date of Patent: April 19, 2022Assignee: dSPACE digital signal processing and control engineering GmbHInventors: Robert Breicher, Van Son Nguyen, Johannes Henkel
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Publication number: 20210195727Abstract: A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.Type: ApplicationFiled: December 21, 2020Publication date: June 24, 2021Applicant: dSPACE digital signal processing and control engineering GmbHInventors: Robert BREICHER, Van Son NGUYEN, Johannes HENKEL
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Patent number: 9596781Abstract: A rack housing that holds a plurality of insertion components includes a plurality of insertion positions that hold the plurality of insertion components in a first area of the rack housing adjacent to a first housing side, a reduced pressure shaft in a second area of the rack housing adjacent to the first area, wherein between the reduced pressure shaft and the insertion components, first openings are provided to thereby remove air heated by the insertion components into the reduced pressure shaft, at least two second openings that suction off heated air from the reduced pressure shaft, and at least two non-return arrangements located in the reduced pressure shaft and correlated to the two second openings, the non-return arrangements preventing entry of air through the correlated second opening if no air is suctioned off through this second opening.Type: GrantFiled: March 10, 2011Date of Patent: March 14, 2017Assignee: FUJITSU LIMITEDInventors: Bernhard Schrader, Van Son Nguyen
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Publication number: 20150058518Abstract: A modular server system includes a plurality of server groups, wherein each server group is adapted to receive a plurality of server modules, and a plurality of I/O groups, wherein each I/O group is adapted to receive a plurality of I/O components and includes a switching arrangement with at least one switch element, wherein each of the plurality of I/O groups is allocated to exactly one of the plurality of server groups, the switch arrangement of each I/O group is directly coupled by a data link to each of the plurality of I/O components of the I/O group, the switch arrangement of each I/O group is directly coupled by a data link to each of the plurality of server modules of the server group allocated to the I/O group, and the switch arrangement of each I/O group is coupled by a data link to at least one other switch arrangement of another I/O group.Type: ApplicationFiled: January 31, 2013Publication date: February 26, 2015Inventors: Michael Kleineberg, Bernhard Schräder, Van Son Nguyen
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Patent number: 8508940Abstract: A rack housing that accommodates a plurality of fanless, plug-in components includes a plurality of plug-in positions that accommodate the plurality of fanless, plug-in components in a first region of the rack housing bordering a first housing side, at least one installation chamber that accommodates at least one add-on component with at least one fan, and at least one low-pressure chamber in a second region of the rack housing bordering the first region, wherein 1) first openings are provided between the low-pressure chamber and the plug-in positions, which openings allow a discharge of air heated by the plug-in components into the low-pressure chamber, 2) the at least one installation chamber and the at least one low-pressure chamber are essentially decoupled from each other with respect to cooling air, and 3) the installation chamber is connected to the low-pressure chamber via at least one connector for forced ventilation.Type: GrantFiled: May 13, 2011Date of Patent: August 13, 2013Assignee: Fujitsu Technology Solutions Intellectual Property GmbHInventors: Gerold Scheidler, Van Son Nguyen
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Publication number: 20130127313Abstract: A rack housing that holds a plurality of insertion components includes a plurality of insertion positions that hold the plurality of insertion components in a first area of the rack housing adjacent to a first housing side, a reduced pressure shaft in a second area of the rack housing adjacent to the first area, wherein between the reduced pressure shaft and the insertion components, first openings are provided to thereby remove air heated by the insertion components into the reduced pressure shaft, at least two second openings that suction off heated air from the reduced pressure shaft, and at least two non-return arrangements located in the reduced pressure shaft and correlated to the two second openings, the non-return arrangements preventing entry of air through the correlated second opening if no air is suctioned off through this second opening.Type: ApplicationFiled: March 10, 2011Publication date: May 23, 2013Applicant: Fujitsu Technology Solutions Intellectual Property GmbHInventors: Bernhard Schräder, Van Son Nguyen
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Publication number: 20120247750Abstract: A server device includes: electronic devices; a housing that houses the electronic devices; at least one fan; air volume control units configured to adjust a volume of cooling airflow which is generated by rotation of the at least one fan and is ventilated through the electronic devices by opening and closing of respective valves; a valve opening control unit configured to control valve opening degrees of the air volume control units so that temperatures inside the electronic devices become a given target temperature; a fan control unit configured to run the at least one fan at a fan rotating speed that achieves a volume of cooling airflow to make temperatures inside the electronic devices become the given target temperature at a valve opening degree higher than the valve opening degrees that the valve opening control unit controls.Type: ApplicationFiled: January 18, 2012Publication date: October 4, 2012Applicants: Fujitsu Technology Solutions Intellectual Property GmbH, Fujitsu LimitedInventors: Hiroki Kobayashi, Yuichi Sato, Takahiro Kimura, Jun Taniguchi, Seiji Hibino, Toshio Sugimoto, Yasushi Umezawa, Reiko Kondo, Bernhard Schräder, Gerold Scheidler, Van Son Nguyen, Geoff Poskitt
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Publication number: 20110285261Abstract: A rack housing that accommodates a plurality of fanless, plug-in components includes a plurality of plug-in positions that accommodate the plurality of fanless, plug-in components in a first region of the rack housing bordering a first housing side, at least one installation chamber that accommodates at least one add-on component with at least one fan, and at least one low-pressure chamber in a second region of the rack housing bordering the first region, wherein 1) first openings are provided between the low-pressure chamber and the plug-in positions, which openings allow a discharge of air heated by the plug-in components into the low-pressure chamber, 2) the at least one installation chamber and the at least one low-pressure chamber are essentially decoupled from each other with respect to cooling air, and 3) the installation chamber is connected to the low-pressure chamber via at least one connector for forced ventilation.Type: ApplicationFiled: May 13, 2011Publication date: November 24, 2011Applicant: Fujitsu Technology Solutions Intellectual Property GmbHInventors: Gerold Scheidler, Van Son Nguyen