Patents by Inventor Van Son Nguyen

Van Son Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240070400
    Abstract: Method of analysis text message syntactically and by content, which entails: step 1; Split syntaxes (made available to subscribers by the network operator) into tokens to store in a Syntax Trie; step 2. Pre-process an incoming text from a subscriber; step 3. Split the text (pre-processed in Step 2) into tokens; step 4. Look up paths that include the tokens (obtained in Step 3) in the Syntax Trie (initialized in Step 1); step 5: Return the look-up result, which is the path in the Syntax Trie that best reflects the user intent.
    Type: Application
    Filed: August 30, 2023
    Publication date: February 29, 2024
    Applicant: VIETTEL GROUP
    Inventors: Van Chung Trinh, Duc Hai Nguyen, Dinh Hung Nguyen, Hai Son Bui, Duc Anh Nguyen, Thi Huyen Trang Nguyen, Thi Thuy Linh Le, Van Chinh Pham, Van Manh Phan
  • Patent number: 11310903
    Abstract: A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: April 19, 2022
    Assignee: dSPACE digital signal processing and control engineering GmbH
    Inventors: Robert Breicher, Van Son Nguyen, Johannes Henkel
  • Publication number: 20210195727
    Abstract: A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 24, 2021
    Applicant: dSPACE digital signal processing and control engineering GmbH
    Inventors: Robert BREICHER, Van Son NGUYEN, Johannes HENKEL
  • Patent number: 9596781
    Abstract: A rack housing that holds a plurality of insertion components includes a plurality of insertion positions that hold the plurality of insertion components in a first area of the rack housing adjacent to a first housing side, a reduced pressure shaft in a second area of the rack housing adjacent to the first area, wherein between the reduced pressure shaft and the insertion components, first openings are provided to thereby remove air heated by the insertion components into the reduced pressure shaft, at least two second openings that suction off heated air from the reduced pressure shaft, and at least two non-return arrangements located in the reduced pressure shaft and correlated to the two second openings, the non-return arrangements preventing entry of air through the correlated second opening if no air is suctioned off through this second opening.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: March 14, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Bernhard Schrader, Van Son Nguyen
  • Publication number: 20150058518
    Abstract: A modular server system includes a plurality of server groups, wherein each server group is adapted to receive a plurality of server modules, and a plurality of I/O groups, wherein each I/O group is adapted to receive a plurality of I/O components and includes a switching arrangement with at least one switch element, wherein each of the plurality of I/O groups is allocated to exactly one of the plurality of server groups, the switch arrangement of each I/O group is directly coupled by a data link to each of the plurality of I/O components of the I/O group, the switch arrangement of each I/O group is directly coupled by a data link to each of the plurality of server modules of the server group allocated to the I/O group, and the switch arrangement of each I/O group is coupled by a data link to at least one other switch arrangement of another I/O group.
    Type: Application
    Filed: January 31, 2013
    Publication date: February 26, 2015
    Inventors: Michael Kleineberg, Bernhard Schräder, Van Son Nguyen
  • Patent number: 8508940
    Abstract: A rack housing that accommodates a plurality of fanless, plug-in components includes a plurality of plug-in positions that accommodate the plurality of fanless, plug-in components in a first region of the rack housing bordering a first housing side, at least one installation chamber that accommodates at least one add-on component with at least one fan, and at least one low-pressure chamber in a second region of the rack housing bordering the first region, wherein 1) first openings are provided between the low-pressure chamber and the plug-in positions, which openings allow a discharge of air heated by the plug-in components into the low-pressure chamber, 2) the at least one installation chamber and the at least one low-pressure chamber are essentially decoupled from each other with respect to cooling air, and 3) the installation chamber is connected to the low-pressure chamber via at least one connector for forced ventilation.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: August 13, 2013
    Assignee: Fujitsu Technology Solutions Intellectual Property GmbH
    Inventors: Gerold Scheidler, Van Son Nguyen
  • Publication number: 20130127313
    Abstract: A rack housing that holds a plurality of insertion components includes a plurality of insertion positions that hold the plurality of insertion components in a first area of the rack housing adjacent to a first housing side, a reduced pressure shaft in a second area of the rack housing adjacent to the first area, wherein between the reduced pressure shaft and the insertion components, first openings are provided to thereby remove air heated by the insertion components into the reduced pressure shaft, at least two second openings that suction off heated air from the reduced pressure shaft, and at least two non-return arrangements located in the reduced pressure shaft and correlated to the two second openings, the non-return arrangements preventing entry of air through the correlated second opening if no air is suctioned off through this second opening.
    Type: Application
    Filed: March 10, 2011
    Publication date: May 23, 2013
    Applicant: Fujitsu Technology Solutions Intellectual Property GmbH
    Inventors: Bernhard Schräder, Van Son Nguyen
  • Publication number: 20120247750
    Abstract: A server device includes: electronic devices; a housing that houses the electronic devices; at least one fan; air volume control units configured to adjust a volume of cooling airflow which is generated by rotation of the at least one fan and is ventilated through the electronic devices by opening and closing of respective valves; a valve opening control unit configured to control valve opening degrees of the air volume control units so that temperatures inside the electronic devices become a given target temperature; a fan control unit configured to run the at least one fan at a fan rotating speed that achieves a volume of cooling airflow to make temperatures inside the electronic devices become the given target temperature at a valve opening degree higher than the valve opening degrees that the valve opening control unit controls.
    Type: Application
    Filed: January 18, 2012
    Publication date: October 4, 2012
    Applicants: Fujitsu Technology Solutions Intellectual Property GmbH, Fujitsu Limited
    Inventors: Hiroki Kobayashi, Yuichi Sato, Takahiro Kimura, Jun Taniguchi, Seiji Hibino, Toshio Sugimoto, Yasushi Umezawa, Reiko Kondo, Bernhard Schräder, Gerold Scheidler, Van Son Nguyen, Geoff Poskitt
  • Publication number: 20110285261
    Abstract: A rack housing that accommodates a plurality of fanless, plug-in components includes a plurality of plug-in positions that accommodate the plurality of fanless, plug-in components in a first region of the rack housing bordering a first housing side, at least one installation chamber that accommodates at least one add-on component with at least one fan, and at least one low-pressure chamber in a second region of the rack housing bordering the first region, wherein 1) first openings are provided between the low-pressure chamber and the plug-in positions, which openings allow a discharge of air heated by the plug-in components into the low-pressure chamber, 2) the at least one installation chamber and the at least one low-pressure chamber are essentially decoupled from each other with respect to cooling air, and 3) the installation chamber is connected to the low-pressure chamber via at least one connector for forced ventilation.
    Type: Application
    Filed: May 13, 2011
    Publication date: November 24, 2011
    Applicant: Fujitsu Technology Solutions Intellectual Property GmbH
    Inventors: Gerold Scheidler, Van Son Nguyen