Abstract: A method of forming an electrically conductive via with bumps on both sides of a substrate wherein there is provided a substrate having a pair of opposing surfaces and a via extending between the opposing surfaces. A layer of a material capable of forming a seed for receiving thereon a plating material is provided on one of the surfaces extending to the via. The structure is then placed into an electroplating bath, preferably gold-containing, to electroplate the walls of the via. The electroplated material is then heated to a temperature above its flow or melting temperature in a reducing atmosphere for a time sufficient to cause the electroplated material to fill the via and any voids within the via. The step of heating the electroplated material is preferably to a temperature at least 10 degrees C. above its flow or melting temperature of the electroplated material. The reducing atmosphere is from about 5 percent to 100 percent hydrogen and the remainder preferably nitrogen.

Abstract: An eyedrop delivery system for administering eyedrops to at least one eye of a user, wherein the system comprises a fluid reservoir for holding a supply of eyedrop fluid, a tube for conducting eyedrop fluid from the fluid reservoir to at least one eye of the user, the tube comprising at least one distal end portion terminating adjacent the at least one eye of the user, fluid driving apparatus for continuously urging eyedrop fluid from the fluid reservoir through the tube toward the at least one distal end portion of the tube, and fluid control apparatus for successively (1) permitting eyedrop fluid to flow freely through the tube so that the eyedrop fluid can begin to exit the at least one distal end portion of the tube, (2) interfering with the flow of eyedrop fluid through the tube so as to prohibit any further eyedrop fluid from exiting the at least one distal end portion of the tube, and so as to cause the eyedrop fluid leaving the at least one distal end portion of the tube to exit the at least one dista