Patents by Inventor Van Wong

Van Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of forming an electronic device including a conductive structure extending through a buried insulating layer
    Patent number: 7820519
    Abstract: A process of forming an electronic device can include providing a semiconductor-on-insulator substrate including a substrate, a first semiconductor layer, and a buried insulating layer lying between the first semiconductor layer and the substrate. The process can also include forming a field isolation region within the semiconductor layer, and forming an opening extending through the semiconductor layer and the buried insulating layer to expose the substrate. The process can further include forming a conductive structure within the opening, wherein the conductive structure abuts the substrate.
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: October 26, 2010
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Todd C. Roggenbauer, Vishnu K. Khemka, Ronghua Zhu, Amitava Bose, Paul Hui, Xiaoqiu Huang, Van Wong
  • PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A CONDUCTIVE STRUCTURE EXTENDING THROUGH A BURIED INSULATING LAYER
    Publication number: 20080124889
    Abstract: A process of forming an electronic device can include providing a semiconductor-on-insulator substrate including a substrate, a first semiconductor layer, and a buried insulating layer lying between the first semiconductor layer and the substrate. The process can also include forming a field isolation region within the semiconductor layer, and forming an opening extending through the semiconductor layer and the buried insulating layer to expose the substrate. The process can further include forming a conductive structure within the opening, wherein the conductive structure abuts the substrate.
    Type: Application
    Filed: November 3, 2006
    Publication date: May 29, 2008
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Todd C. ROGGENBAUER, Vishnu K. KHEMKA, Ronghua ZHU, Amitava BOSE, Paul HUI, Xiaoqiu HUANG, Van WONG