Patents by Inventor Vandan Tanna

Vandan Tanna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210013092
    Abstract: Polishing slurries for polishing semiconductor substrates are disclosed. The polishing slurry may include first and second sets of colloidal silica particles with the second set having a silica content greater than the first set.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Inventors: Hui Wang, Vandan Tanna, Tracy Michelle Ragan, James Raymond Capstick
  • Patent number: 10811307
    Abstract: Polishing slurries for polishing semiconductor substrates are disclosed. The polishing slurry may include first and second sets of colloidal silica particles with the second set having a silica content greater than the first set.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: October 20, 2020
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Hui Wang, Vandan Tanna, Tracy Michelle Ragan, James Raymond Capstick
  • Patent number: 10654193
    Abstract: Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: May 19, 2020
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Peter D. Albrecht, Carlos Zavattari, Sumeet S. Bhagavat, Vandan Tanna, Uwe Hermes
  • Publication number: 20190270222
    Abstract: Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.
    Type: Application
    Filed: May 16, 2019
    Publication date: September 5, 2019
    Inventors: Peter D. Albrecht, Carlos Zavattari, Sumeet S. Bhagavat, Vandan Tanna, Uwe Hermes
  • Patent number: 10315337
    Abstract: Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: June 11, 2019
    Assignee: GlobalWafers Co. Ltd.
    Inventors: Peter D. Albrecht, Carlo Zavattari, Sumeet S. Bhagavat, Vandan Tanna, Uwe Hermes
  • Publication number: 20190035675
    Abstract: Polishing slurries for polishing semiconductor substrates are disclosed. The polishing slurry may include first and second sets of colloidal silica particles with the second set having a silica content greater than the first set.
    Type: Application
    Filed: October 2, 2018
    Publication date: January 31, 2019
    Inventors: Hui Wang, Vandan Tanna, Tracy Michelle Ragan, James Raymond Capstick
  • Patent number: 10128146
    Abstract: Polishing slurries for polishing semiconductor substrates are disclosed. The polishing slurry may include first and second sets of colloidal silica particles with the second set having a silica content greater than the first set.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: November 13, 2018
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Hui Wang, Vandan Tanna, Tracy Michelle Ragan, James Raymond Capstick
  • Publication number: 20180056545
    Abstract: Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.
    Type: Application
    Filed: August 25, 2016
    Publication date: March 1, 2018
    Inventors: Peter D. Albrecht, Carlo Zavattari, Sumeet S. Bhagavat, Vandan Tanna, Uwe Hermes
  • Publication number: 20170256439
    Abstract: Polishing slurries for polishing semiconductor substrates are disclosed. The polishing slurry may include first and second sets of colloidal silica particles with the second set having a silica content greater than the first set.
    Type: Application
    Filed: July 28, 2016
    Publication date: September 7, 2017
    Applicant: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Hui Wang, Vandan Tanna, Tracy Michelle Ragan, James Raymond Capstick
  • Publication number: 20170053826
    Abstract: Polishing slurries for polishing semiconductor substrates are disclosed. The polishing slurry may include first and second sets of colloidal silica particles with the second set having a silica content greater than the first set.
    Type: Application
    Filed: July 28, 2016
    Publication date: February 23, 2017
    Applicant: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Hui Wang, Vandan Tanna, Tracy Michelle Ragan, James Raymond Capstick
  • Publication number: 20140150826
    Abstract: A wafer cleaning apparatus includes a beam for holding a plurality of semiconductor or solar wafers. The beam includes at least one channel extending axially through the beam. An opening extends from the channel to a location between adjacent wafers. A manifold includes a conduit coupled to the channel and an immersion tank includes an ultrasonic transducer.
    Type: Application
    Filed: November 27, 2013
    Publication date: June 5, 2014
    Inventors: Peter D. Albrecht, Brian Schulte, Vandan Tanna, Terry Grace, Desmond Teo, Fu Shun Ng
  • Publication number: 20130121802
    Abstract: Systems and methods are disclosed for transporting wafers to a processing apparatus. The system comprises a frame having a support sized for receiving a wafer assembly including the wafers. An alignment system is connected to the frame. The alignment system is disposed for guiding the wafer assembly to a first position as the wafer assembly is lowered onto the support of the frame. The alignment system reduces the amount of time required to transport the wafers to the processing apparatus.
    Type: Application
    Filed: November 14, 2011
    Publication date: May 16, 2013
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Peter D. Albrecht, Vandan Tanna
  • Publication number: 20110017230
    Abstract: Systems and methods are provided for processing abrasive slurry used in cutting operations. The slurry is mixed with a first solvent in a tank. The slurry is vibrated and/or ultrasonically agitated such that abrasive grain contained in the slurry separates from the other components of the slurry and the first solvent. After the abrasive grain has settled to a bottom portion of the container, the other components of the slurry and the first solvent are removed from the tank. The abrasive grain may then be washed with a second solvent. The abrasive grain is then heated and is suitable for reuse in an abrasive slurry.
    Type: Application
    Filed: July 21, 2010
    Publication date: January 27, 2011
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Henry F. Erk, Vandan Tanna