Abstract: A thermosetting resin. The resin includes a silane and a co-reactant monomer. The silane includes a quaternary silicon atom with first and second non-hydrolyzable moieties chemically bonded thereto. Each of the first and second non-hydrolyzable moieties includes respective first and second reactive groups. The reactive groups include at least one aromatic or unsaturated group having a triple bond.

Abstract: A reactive, non-hydrolyzable silane. The silane comprises a quaternary silicon atom and first and second terminal groups. Each of the first and second terminal groups is chemically bonded to the quaternary silicon atom and is selected from a group consisting of cyanate ester, epoxide, episulfide, acrylate, alkene, styrenic, maleimide, phthalonitrile, acetylene, aryl ethynylene, benzoxazine, anthracene, aniline, trifluorovinyl ether, and perfluorocyclobutyl.

Abstract: A thermosetting resin. The resin includes a silane and a co-reactant monomer. The silane includes a quaternary silicon atom with first and second non-hydrolyzable moieties chemically bonded thereto. Each of the first and second non-hydrolyzable moieties includes respective first and second reactive groups. The reactive groups include at least one aromatic or unsaturated group having a triple bond.

Abstract: Novel POSS mono- and dianiline compounds, their synthesis procedures, and applications in host materials for the purposes of property enhancement are described. This class of POSS compounds features completely aromatic peripheries and partial amine functionality for facile and controlled reactive incorporation into a variety of polymers, and further utility may be derived from reactions of the available amine groups with anhydrides such as phenylethynyl phthalic anhydride (PEPA) to form reactive imide-type oligomers for incorporation into high performance thermosetting polymers. Modification of polymer hosts with the subject nanoparticles can result in a variety of property improvements including mechanical, thermal, tribological, electrical, as well as improved moisture resistance.

Abstract: A. new compound, a high temperature POSS-dianiline is provided. It is a composition of nanoparticles, which can be incorporated into polymers such as polyimides, polyamides, cyanate esters, and epoxies, for improved properties and performance of such polymers.