Patents by Inventor Vandentop Gilroy

Vandentop Gilroy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical/optical integration scheme using direct copper bonding
    Publication number: 20060258120
    Abstract: An electro-optic semiconductor package and fabrication method provides enhanced performance. An integrated circuit (IC) having one or more IC contact pads is provided, where the IC contact pads are connected to an IC on the IC wafer. An intermediate wafer having one or more intermediate contact pads is provided, where the intermediate contact pads are connected to an electro-optic arrangement on the intermediate wafer. The method further provides for direct copper bonding the IC contact pads to adjacent intermediate contact pads such that an electro-optic semiconductor package results.
    Type: Application
    Filed: July 14, 2006
    Publication date: November 16, 2006
    Inventors: Vandentop Gilroy, Jun-Fei Zheng