Abstract: Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over a Printed Circuit Board (PCB), which may have other integrated circuits on an opposite side. Among other things, the disclosed apparatus, system, and method improve over previous systems by providing holes and vias that facilitate communication between a custom chip above the PCB and a field-programmable gate array (FPGA) below. The thin film electrode array can be fastened by bucking a pillar of stacked gold or other metal balls to rivet the thin film flex circuit. The system can include a thin film array having embedded wire traces and holes, a PCB having vias aligned with the holes, chips including an analog-to-digital converter (ADC) sandwiching the thin film, and solder connections from the chips through the holes to the vias.

Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.

Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.

Abstract: A brain-machine interface (BMI) is described in which many flexible electrodes for implanting within a subject's brain run to a cylindrical sensor device configured to fit inside a burr hole in the cranium. The devices contain sealed electronics that convert analog neural voltages to digital signals, or vice versa, and connects through a serial cable to a subcutaneous relay on the mastoid region (behind the subject's ear) or other suitable location. The relay draws power from and communicates with an externally worn device and distributes the power to the devices. The externally worn device communicates wirelessly or through a tether to a base station computer for data analysis and/or stimulation.

Abstract: Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over a Printed Circuit Board (PCB), which may have other integrated circuits on an opposite side. Among other things, the disclosed apparatus, system, and method improve over previous systems by providing holes and vias that facilitate communication between a custom chip above the PCB and a field-programmable gate array (FPGA) below. The thin film electrode array can be fastened by bucking a pillar of stacked gold or other metal balls to rivet the thin film flex circuit. The system can include a thin film array having embedded wire traces and holes, a PCB having vias aligned with the holes, chips including an analog-to-digital converter (ADC) sandwiching the thin film, and solder connections from the chips through the holes to the vias.

Abstract: Disclosed are biocompatible multi-electrode devices capable of being implanted in sensitive tissue, such as the brain, and methods for fabricating such arrays. The disclosed arrays can be implanted in living biological tissue with a single needle insertion. The devices can include linear arrays with contacts along an edge, linear arrays with multiple electrodes per opening in a parylene support layer, multi-thread electrode arrays, tree-like electrode arrays, and combinations thereof. In an embodiment, a compliant electrode apparatus can comprise a biocompatible and bio-implantable compliant dielectric having a top edge defined by a top and a side along a length of the dielectric, insulated electrical traces oriented along the length of the dielectric, and electrode contacts coupled to the traces and situated on the side along the length of the dielectric, wherein an exposed portion of a respective electrode contact protrudes beyond the top edge of the dielectric.