Patents by Inventor Vankataramanan Balakrishnan

Vankataramanan Balakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8745563
    Abstract: A system for simulating operation of a VLSI interconnect structure having capacitive and inductive coupling between nodes thereof, including a processor, and a memory, the processor configured to perform obtaining a matrix X and a matrix Y containing different combinations of passive circuit element values for the interconnect structure, the element values for each matrix including inductance L and inverse capacitance P, obtaining an adjacency matrix A associated with the interconnect structure, storing the matrices X, Y, and A in the memory, and performing numerical integration to solve first and second equations.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: June 3, 2014
    Assignee: Purdue Research Foundation
    Inventors: Jitesh Jain, Stephen F Cauley, Hong Li, Cheng-Kok Koh, Vankataramanan Balakrishnan