Abstract: A light-tight laser enclosure system including an enclosure, a robotic laser, first and second pass through partitions, and first and second rotary positioners. The robotic laser is positioned within an interior volume of the enclosure and defines a processing envelope. The first pass through partition defines a first passage in selective communication with interior and exterior volumes of the enclosure, and is configured to maintain a light-tight configuration as the first passage is placed in selective communication with the interior and exterior volumes. The second pass through partition defines a second passage in selective communication with interior and exterior volumes of the enclosure, and is configured to maintain a light-tight configuration as the second passage is placed in selective communication with the interior and exterior volumes. The first and second rotary positioners are configured to secure a workpiece within the first and the second passages, respectively.

Abstract: A workpiece enclosure system of the present invention includes a workpiece loading section, a laser workstation cell, and a workpiece unloading section. The workpiece loading section includes a materials handling robot arranged to move workpieces from an input conveyor to a light-tight pass-through enclosure in communication with the laser workstation cell. The laser workstation cell includes an additional materials handling robot arranged to move workpieces from the pass-through enclosure to one of two dual headstock/tailstock positioners for laser operations. Preferably, two sets of laser-cutting robots are arranged to perform laser-cutting operations on workpieces held by the headstock/tailstock positioners. The materials handling robot is further arranged to move workpieces from the headstock/tailstock positioners to an additional pass-through enclosure in communication with the workpiece unloading section.

Abstract: A workpiece enclosure system of the present invention includes a workpiece loading section, a laser workstation cell, and a workpiece unloading section. The workpiece loading section includes a materials handling robot arranged to move workpieces from an input conveyor to a light-tight pass-through enclosure in communication with the laser workstation cell. The laser workstation cell includes an additional materials handling robot arranged to move workpieces from the pass-through enclosure to one of two dual headstock/tailstock positioners for laser operations. Preferably, two sets of laser-cutting robots are arranged to perform laser-cutting operations on workpieces held by the headstock/tailstock positioners. The materials handling robot is further arranged to move workpieces from the headstock/tailstock positioners to an additional pass-through enclosure in communication with the workpiece unloading section.