Abstract: A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.

Abstract: An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively transferring heat from the chip to the heatsink. The interposer includes a compressible, resilient member (e.g., an elastomeric pad) and a plurality of thin, metallic sheets (e.g., copper foils) and the thickness thereof can be adjusted by altering the number of such foils.

Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure for directing cooling fluid (e.g., air) toward and over the devices, the structure including a fan for directing cooling fluid in a first direction and a plurality of fluid deflectors for deflecting at least part of the fluid toward respective ones of the devices.

Abstract: A wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow. A method of making the package is also provided, as is an information handling system (e.g., computer) adapted for utilizing such packages.

Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.