Patents by Inventor Varaprasad V. Calmidi

Varaprasad V. Calmidi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130025839
    Abstract: An organic substrate capable of providing effective heat transfer through its entire thickness by the use of parallel, linear common thermally conductive openings that extend through the substrate, the substrate having thin dielectric layers bonded together to form an integral substrate structure. The structure is adapted for assisting in providing cooling of high temperature electrical components on one side by effectively transferring heat from the components to a cooling structure positioned on an opposing side. Methods of making the substrate are also provided, as is an electrical assembly including the substrate, component and cooling structure.
    Type: Application
    Filed: July 25, 2011
    Publication date: January 31, 2013
    Applicant: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
    Inventors: Frank Egitto, Voya R. Markovich, Varaprasad V. Calmidi, Timothy Antesberger, William E. Wilson
  • Patent number: 7851906
    Abstract: A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: December 14, 2010
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: David J. Alcoe, Varaprasad V. Calmidi
  • Patent number: 7629684
    Abstract: An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively transferring heat from the chip to the heatsink. The interposer includes a compressible, resilient member (e.g., an elastomeric pad) and a plurality of thin, metallic sheets (e.g., copper foils) and the thickness thereof can be adjusted by altering the number of such foils.
    Type: Grant
    Filed: April 4, 2006
    Date of Patent: December 8, 2009
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: David J. Alcoe, Varaprasad V. Calmidi
  • Patent number: 7510324
    Abstract: A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: March 31, 2009
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
  • Patent number: 7510912
    Abstract: A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: March 31, 2009
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: David V. Caletka, Varaprasad V. Calmidi, Sanjeev Sathe
  • Patent number: 7490984
    Abstract: A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: February 17, 2009
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
  • Publication number: 20080237840
    Abstract: A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.
    Type: Application
    Filed: March 26, 2007
    Publication date: October 2, 2008
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: David J. Alcoe, Varaprasad V. Calmidi
  • Publication number: 20080170670
    Abstract: A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.
    Type: Application
    Filed: August 2, 2007
    Publication date: July 17, 2008
    Applicant: Endicott Interconnect Technologies , Inc.
    Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Sanjeev Sathe
  • Publication number: 20080144768
    Abstract: A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.
    Type: Application
    Filed: February 22, 2008
    Publication date: June 19, 2008
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara,, Sanjeev Sathe
  • Patent number: 7354197
    Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: April 8, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
  • Patent number: 7261466
    Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure for directing cooling fluid (e.g., air) toward and over the devices, the structure including a fan for directing cooling fluid in a first direction and a plurality of fluid deflectors for deflecting at least part of the fluid toward respective ones of the devices.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: August 28, 2007
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
  • Patent number: 7253518
    Abstract: A wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow. A method of making the package is also provided, as is an information handling system (e.g., computer) adapted for utilizing such packages.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: August 7, 2007
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: David V. Caletka, Varaprasad V. Calmidi, Sanjeev Sathe
  • Patent number: 7186590
    Abstract: An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: March 6, 2007
    Assignee: International Business Machines Corporation
    Inventors: David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Sanjeev B. Sathe, Randall J. Stutzman
  • Patent number: 7183642
    Abstract: Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: February 27, 2007
    Assignee: International Business Machines Corporation
    Inventors: Anandaroop Bhattacharya, Varaprasad V. Calmidi, Sanjeev B. Sathe
  • Publication number: 20040057214
    Abstract: An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
    Type: Application
    Filed: September 18, 2003
    Publication date: March 25, 2004
    Inventors: David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Sanjeev B. Sathe, Randall J. Stutzman
  • Publication number: 20040046249
    Abstract: Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.
    Type: Application
    Filed: September 11, 2002
    Publication date: March 11, 2004
    Applicant: International Business Machines Corporation
    Inventors: Anandaroop Bhattacharya, Varaprasad V. Calmidi, Sanjeev B. Sathe
  • Patent number: 6665187
    Abstract: An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: December 16, 2003
    Assignee: International Business Machines Corporation
    Inventors: David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Sanjeev B. Sathe, Randall J. Stutzman
  • Patent number: 6665186
    Abstract: A heat dissipating system utilizes a thin layer of a high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat from the chip to a heat sink or heat spreader. The system includes one or more vents that allow for filling and venting of the space occupied by the liquid. It also utilizes a flexible seal, such as an O-ring or a membrane held in place with a retainer ring, or a plug that seals the filling vent. The seal flexes to accommodate expansion and contraction of the liquid, as well as phase changes from the liquid phase to the solid phase.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: December 16, 2003
    Assignee: International Business Machines Corporation
    Inventors: Varaprasad V. Calmidi, Eric A. Johnson, Randall J. Stutzman
  • Patent number: 6622786
    Abstract: A heat sink structure is formed by stacking a plurality of heat sink layers. Each layer comprises an array of vertically disposed heat dissipating elements extending from a base plate. Cut outs are formed in each of the base plates to form openings so that when the layers are stacked, each of the ascending successive layers has a larger opening than the layer upon which it rests. Cooling may be by forced air or natural convection. With forced air, air impinges on the top of the stack and into the opening in the base plates. Because of diminishing size of the openings in the stack, a portion of the air is forced out the sides of each layer. With natural convection, air is drawn into the sides of each layer and the hot air at the center flows upwardly through the openings with increasing volume as it rises.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: September 23, 2003
    Assignee: International Business Machines Corporation
    Inventors: Varaprasad V. Calmidi, Krishna Darbha, Sanjeev B. Sathe, Jamil A. Wakil