Abstract: A platen for use in a laminating press is provided which includes a body of material having first and second faces and spaced first and second ends. Preferably, at least one heating device is disposed in the body of material. First and second spaced cooling channels are formed in the body of material, the first cooling channel being adjacent the first face and having a fluid inlet port adjacent to or in the first end, and a fluid outlet port adjacent to or in the second end, and a second cooling channel being adjacent the second face and having a fluid inlet port adjacent to or in said second end, and a fluid outlet port adjacent to or in the first end. The invention also contemplates using such platens for laminating a book or stack of sheets of material to form a unitary single member having reduced stresses.

Abstract: A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper surface of the electronic module by way of mechanical linkage to the PCB. The heat dissipating flexible standoff provides a force opposing the compression force to thereby reduce stress on solder ball connections between electronic module and PCB. Thermally conductive flexible standoffs in the form of spring arrangements, such as a wire mesh, act to provide heat dissipation by both thermal conduction and thermal convection. A thermally conductive flexible polymer pad and a layer of porous metal foam may also act as thermally conductive standoffs.

Abstract: A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper surface of the electronic module by way of mechanical linkage to the PCB. The heat dissipating flexible standoff provides a force opposing the compression force to thereby reduce stress on solder ball connections between electronic module and PCB. Thermally conductive flexible standoffs in the form of spring arrangements, such as a wire mesh, act to provide heat dissipation by both thermal conduction and thermal convection. A thermally conductive flexible polymer pad and a layer of porous metal foam may also act as thermally conductive standoffs.

Abstract: A platen for use in a laminating press is provided which includes a body of material having first and second faces and spaced first and second ends. Preferably, at least one heating device is disposed in the body of material. First and second spaced cooling channels are formed in the body of material, the first cooling channel being adjacent the first face and having a fluid inlet port adjacent to or in the first end, and a fluid outlet port adjacent to or in the second end, and a second cooling channel being adjacent the second face and having a fluid inlet port adjacent to or in said second end, and a fluid outlet port adjacent to or in the first end. The invention also contemplates using such platens for laminating a book or stack of sheets of material to form a unitary single member having reduced stresses.