Patents by Inventor Varinder Chohan

Varinder Chohan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compositions containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous meterial
    Publication number: 20050214448
    Abstract: A heterocyclic nitrogen and glycol containing solvent swell composition and method of using the composition. The solvent swell compositions may contain high flash point solvents and water. The solvent swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The heterocyclic nitrogen and glycol solvent swell composition also desmears resin material from substrates. The heterocyclic and glycol solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by suitable plating methods.
    Type: Application
    Filed: November 29, 2004
    Publication date: September 29, 2005
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: John Graves, Varinder Chohan, Deborah Hirst, Mark Poole
  • Compositions containing heterocylcic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material
    Publication number: 20030021887
    Abstract: A heterocyclic nitrogen and glycol containing solvent swell composition and method of using the composition. The solvent swell compositions may contain high flash point solvents and water. The solvent swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The heterocyclic nitrogen and glycol solvent swell composition also desmears resin material from substrates. The heterocyclic and glycol solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by suitable plating methods.
    Type: Application
    Filed: March 8, 2002
    Publication date: January 30, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: John E. Graves, Varinder Chohan, Deborah V. Hirst, Mark A. Poole