Patents by Inventor Varinder Kumar Kalra

Varinder Kumar Kalra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fuse and arc resistant end cap assembly therefor
    Patent number: 8471671
    Abstract: Overcurrent protection fuses with end cap assemblies amenable to automated manufacturing techniques and providing arc burn through resistance when the fusible element opens therein. The end cap assemblies may include washers having arc resistant compositions and may include single or double end cap constructions. Fuse rejection features may be formed in one of the end caps and may create an empty space in the end cap when assembled to a fuse body.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: June 25, 2013
    Assignee: Cooper Technologies Company
    Inventors: Keith Allen Spalding, Varinder Kumar Kalra
  • FUSE AND ARC RESISTANT END CAP ASSEMBLY THEREFOR
    Publication number: 20120068810
    Abstract: Overcurrent protection fuses with end cap assemblies amenable to automated manufacturing techniques and providing arc burn through resistance when the fusible element opens therein. The end cap assemblies may include washers having arc resistant compositions and may include single or double end cap constructions. Fuse rejection features may be formed in one of the end caps adjacent and may create empty spaces in the end caps.
    Type: Application
    Filed: September 17, 2010
    Publication date: March 22, 2012
    Inventors: Keith Allen Spalding, Varinder Kumar Kalra
  • Low resistance polymer matrix fuse apparatus and method
    Publication number: 20080218305
    Abstract: A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.
    Type: Application
    Filed: May 19, 2008
    Publication date: September 11, 2008
    Applicant: COOPER TECHNOLOGIES COMPANY
    Inventors: Joan Leslie Bender, Hundi Panduranga Kamath, Varinder Kumar Kalra, Daniel Minas Manoukian, Peter York So
  • Low resistance polymer matrix fuse apparatus and method
    Patent number: 7385475
    Abstract: A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: June 10, 2008
    Assignee: Cooper Technologies Company
    Inventors: Joan Leslie Bender, Hundi Panduranga Kamath, Varinder Kumar Kalra, Daniel Minas Manoukian, Peter York So
  • Surface mount standoff for printed circuit board assembly
    Patent number: 6587351
    Abstract: A standoff for a printed circuit board assembly is described. The standoff comprises at least one surface configured for surface mounting to a printed circuit board.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: July 1, 2003
    Assignee: Cooper Technologies
    Inventors: Jeffrey Lynn Hollinsworth, Randy John Bicknese, Varinder Kumar Kalra, Keith Allen Spalding
  • Surface mount standoff for printed circuit board assembly
    Publication number: 20020145857
    Abstract: A standoff for a printed circuit board assembly is described. The standoff comprises at least one surface configured for surface mounting to a printed circuit board.
    Type: Application
    Filed: April 2, 2002
    Publication date: October 10, 2002
    Inventors: Jeffrey Lynn Hollinsworth, Randy John Bicknese, Varinder Kumar Kalra, Keith Allen Spalding