Patents by Inventor Vartan Babayan

Vartan Babayan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated filament attachment system for vacuum fluorescent display
    Patent number: 7407079
    Abstract: A filament attachment system includes a bond head comprising a de-spooling system with a spool and balanced dancer arm assembly, a clamp having a curved filament entry, a narrower gripping region, and a wider filament exit, and a bond tool comprising a guide portion, a grooving portion, and a staking portion. The grooving portion forms a groove into a bond and the staking portion closes the groove over the filament, securing the filament in the bond. Thus, the filament can be attached with a single pass of the bond head using a single bond.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: August 5, 2008
    Assignee: Orthodyne Electronics Corporation
    Inventors: Theodore J. Copperthite, Todd J. Walker, Vartan Babayan, Martin R. Nicholls
  • Automated filament attachment system for vacuum fluorescent display
    Publication number: 20050087585
    Abstract: A filament attachment system includes a bond head comprising a de-spooling system with a spool and balanced dancer arm assembly, a clamp having a curved filament entry, a narrower gripping region, and a wider filament exit, and a bond tool comprising a guide portion, a grooving portion, and a staking portion. The grooving portion forms a groove into a bond and the staking portion closes the groove over the filament, securing the filament in the bond. Thus, the filament can be attached with a single pass of the bond head using a single bond.
    Type: Application
    Filed: October 23, 2003
    Publication date: April 28, 2005
    Inventors: Theodore Copperthite, Todd Walker, Vartan Babayan, Martin Nicholls
  • Articulated wire bonder
    Patent number: 5868300
    Abstract: A wire bonding head supported for movement upwardly and downwardly having a wire bonding tool connected to an ultrasonic driver in order to sonically bond a wire to an underlying electrical component. The wire is fed to the bonding tool, and fed broken and clamped by a linkage connected to at least one stepper motor. A processing unit is mounted on the bonding head for controlling the clamping, feeding, and breaking of the wire.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: February 9, 1999
    Assignee: Orthodyne Electronics Corporation
    Inventor: Vartan Babayan