Abstract: A thin plastic light guide is formed to have cavities on one surface and TIR (total internal reflection) structures directly above the cavities. LEDs mounted on a printed circuit board are positioned in the cavities. The cavity walls are shaped to refract the LED light and direct the LED light toward the TIR structures to most efficiently make use of the TIR structures. The TIR structures may have a cusp or cone shape. The top ceiling of the cavities may be shaped to direct light at the TIR structure so as to leak through the TIR structure and blend the light with light leaking through surrounding portions of the light guide. The LEDs may be distributed only near the edges of the light guide or over the entire back surface of the light guide. A diffuser sheet may be laminated over the light guide to further mix the light.

Abstract: Described herein is source sensitive optic that uses reconfigurable chip-on-board (CoB) light emitting diode (LED) arrays as light sources. In an implementation, the reconfigurable CoB LED array includes a predetermined number of LEDs that are configurable for a variety of illumination scenarios. In an implementation, the reconfigurable CoB LED array is multiple CoB LED arrays that are configured for use with the source sensitive optic as described herein. The source sensitive optic includes surface shapes that are responsive to the reconfigurable CoB LED array. The source sensitive optic is configured to provide beam profile and radiation pattern differentiation based on a CoB LED array configuration configured from the reconfigurable CoB LED. Each configurable CoB LED array configuration radiates a different beam pattern via the surface shapes due to proximity and surface shape geometries.

Abstract: A device includes a light-emitting device (LED) having at least two vertical light-emitting sides, and a ring-shaped light guide having a bottom side, a top side comprising a light-emitting surface, an inner sidewall, and an outer sidewall defining an indentation having at least two vertical in-coupling surfaces mated to the at least two vertical light-emitting sides of the LED.