Abstract: A semiconductor package includes: a substrate having a metallic surface; a semiconductor die metallurgically bonded to the metallic surface of the substrate by a first solder joint; and a solder wetting structure metallurgically welded to the metallic surface of the substrate outside a perimeter of the semiconductor die and adjacent to one or more side faces of the semiconductor die. Excess solder squeezed out from under the semiconductor die is metallurgically bonded to the solder wetting structure. Methods of producing the semiconductor package and solder wetting structure are also described.

Abstract: Techniques for a privacy-based user data sharing protocol disclose a system that receives a request to consent to share user data with a subscriber device. The system identifies, based on the request, a smart contract associated with the subscriber device. The smart contract comprises one or more conditions for collecting and managing the user data. The system generates a token based on the smart contract, in which the token indicates consent by a user to share the user data with the subscriber device according to the one or more conditions. The system records the generated token to a blockchain.