Abstract: A power converter apparatus includes a parent circuit board including a first surface, a second surface, and a thermal conductor core disposed intermediate the first surface and the second surface. A first child circuit is board mounted on the parent circuit board. A first plurality of power switches are operatively coupled with the first child circuit board. A second child circuit is board operatively coupled with the parent circuit board. A second plurality of power switches are operatively coupled with the second child circuit board. A first heat transfer circuit includes a first set of conductors thermally conductively coupling the first plurality of power switches with the thermal conductor core. A second heat transfer circuit includes a second set of conductors thermally conductively coupling the second plurality of power switches with the thermal conductor core.

Abstract: A power converter apparatus includes a parent circuit board comprising a first surface, a second surface, and a thermal conductor core disposed intermediate the first surface and the second surface. A first child circuit is board mounted on the parent circuit board. A first plurality of power switches are operatively coupled with the first child circuit board. A second child circuit is board operatively coupled with the parent circuit board. A second plurality of power switches are operatively coupled with the second child circuit board. A first heat transfer circuit includes a first set of conductors thermally conductively coupling the first plurality of power switches with the thermal conductor core. A second heat transfer circuit includes a second set of conductors thermally conductively coupling the second plurality of power switches with the thermal conductor core.