Patents by Inventor Vasil Pano

Vasil Pano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11843434
    Abstract: Low latency beamforming using phased antenna arrays is the key for practical deployment of envisioned millimeter wave (mmWave) Gbps mobile networks. This work aims towards reducing the overhead of the exhaustive sector-level sweep phase of the analog beamforming adopted in the IEEE 802.11ad standard. This system uses a reconfigurable antenna single RF chain in the sub-6 GHz new radio (NR) band to aid codebook-based beam selection in the mmWave band of the NR. The system exploits the congruence between the spatial propagation signatures of signals at both mmWave and sub-6 GHz frequencies to reduce the beam search space.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: December 12, 2023
    Assignee: Drexel University
    Inventors: Oday Bshara, Vasil Pano, Md Abu Saleh Tajin, Kapil R. Dandekar
  • Patent number: 11329362
    Abstract: On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. A Through-Silicon Via (TSV)-based antenna design called TSV_A establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30 mm on-chip distance. Simulation results show an improvement in network latency up to ˜13% (average improvement of ˜7%), energy-delay improvements of ˜34% on average, and an improvement in throughput up to ˜34% (average improvement).
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: May 10, 2022
    Assignee: Drexel University
    Inventors: Vasil Pano, Ibrahim Tekin, Baris Taskin, Kapil R. Dandekar, Yuqiao Liu
  • Publication number: 20210306042
    Abstract: Low latency beamforming using phased antenna arrays is the key for practical deployment of envisioned millimeter wave (mmWave) Gbps mobile networks. This work aims towards reducing the overhead of the exhaustive sector-level sweep phase of the analog beamforming adopted in the IEEE 802.11ad standard. This system uses a reconfigurable antenna single RF chain in the sub-6 GHz new radio (NR) band to aid codebook-based beam selection in the mmWave band of the NR. The system exploits the congruence between the spatial propagation signatures of signals at both mmWave and sub-6 GHz frequencies to reduce the beam search space.
    Type: Application
    Filed: March 26, 2021
    Publication date: September 30, 2021
    Applicant: Drexel University
    Inventors: Oday Bshara, Vasil Pano, Md Abu Saleh Tajin, Kapil R. Dandekar
  • Publication number: 20200212538
    Abstract: On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. A Through-Silicon Via (TSV)-based antenna design called TSV_A establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30 mm on-chip distance. Simulation results show an improvement in network latency up to ˜13% (average improvement of ˜7%), energy-delay improvements of ˜34% on average, and an improvement in throughput up to ˜34% (average improvement).
    Type: Application
    Filed: December 18, 2019
    Publication date: July 2, 2020
    Applicant: Drexel University
    Inventors: Vasil Pano, Ibrahim Tekin, Baris Taskin, Kapil R. Dandekar, Yuqiao Liu