Abstract: Examples of the disclosure relate to heat exchangers. The heat exchangers could be evaporators or condensers. The heat exchangers can comprise a plurality of structures extending from a base plate where adjacent structures are separated by at least a first distance. The heat exchangers can also comprise at least one cover plate positioned over ends of the plurality of structures so that the at least one cover plate is spaced from the ends of the plurality of structures by a second distance where the second distance is smaller than the first distance. The at least one cover plate is brazed to the plurality of structures by brazing material provided between the ends of the plurality of structures and the at least one cover plate.

Abstract: Examples of the disclosure relate to heat exchangers. The heat exchangers can comprise a plurality of channels configured for flow of working fluid. The plurality of channels can be configured to move between a non-expanded configuration and an expanded configuration such that, in the non-expanded configuration the plurality of channels are sized so as to allow for movement of the heat exchanger relative to one or more heat sources and in the expanded configuration the plurality of channels are sized so as to restrict movement of the heat exchanger relative to the one or more heat sources. The plurality of channels are configured so that changes in internal pressure of the working fluid causes the plurality of channels to move between the non-expanded configuration and the expanded configuration.

Abstract: A cooling apparatus includes thermosyphon loops for cooling multiple electronic devices. Each of the thermosyphon loops includes at least one evaporator and at least one condenser. Sensors within the thermosyphon loop measure can measure various parameters such as vapour quality within an inlet and outlet of at least one of the evaporators, total heat load of at least one of the evaporators; and the liquid level in a downcomer of the thermosyphon loop.

Abstract: Examples of the disclosure relate to a cooling system for cooling one or more electronic components. The cooling system comprises at least one two-phase cooling system configured to cool one or more electronic components that are thermally coupled to the at least one two-phase cooling system and at least one air-cooling system configured to cool one or more electronic components. The at least one air-cooling system comprises at least one heat exchanger within the at least one air-cooling system wherein the at least one heat exchanger is coupled to a two-phase cooling system or a liquid phase cooling system. The at least one air-cooling system also comprises recirculation means configured to re-circulate air through the at least one air-cooling system to the one or more electronic components.