Patents by Inventor Vasili Perebeinos

Vasili Perebeinos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9772448
    Abstract: A signal transfer link includes a first plasmonic coupler, and a second plasmonic coupler spaced apart from the first plasmonic coupler to form a gap. A plasmonic conductive layer is formed over the gap to excite plasmons to provide signal transmission between the first and second plasmonic couplers.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: September 26, 2017
    Assignee: International Business Machines Corporation
    Inventors: Phaedon Avouris, Vasili Perebeinos, Mathias B. Steiner, Alberto Valdes Garcia
  • Patent number: 9417387
    Abstract: A signal transfer link includes a first plasmonic coupler, and a second plasmonic coupler spaced apart from the first plasmonic coupler to form a gap. An insulator layer is formed over end portions of the first and second plasmonic couplers and in and over the gap. A plasmonic conductive layer is formed over the gap on the insulator layer to excite plasmons to provide signal transmission between the first and second plasmonic couplers.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: August 16, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Phaedon Avouris, Vasili Perebeinos, Mathias B. Steiner, Alberto Valdes Garcia
  • Publication number: 20160216447
    Abstract: A signal transfer link includes a first plasmonic coupler, and a second plasmonic coupler spaced apart from the first plasmonic coupler to form a gap. A plasmonic conductive layer is formed over the gap to excite plasmons to provide signal transmission between the first and second plasmonic couplers.
    Type: Application
    Filed: March 31, 2016
    Publication date: July 28, 2016
    Inventors: PHAEDON AVOURIS, VASILI PEREBEINOS, MATHIAS B. STEINER, ALBERTO VALDES GARCIA
  • Patent number: 9335471
    Abstract: A signal transfer link includes a first plasmonic coupler, and a second plasmonic coupler spaced apart from the first plasmonic coupler to form a gap. An insulator layer is formed over end portions of the first and second plasmonic couplers and in and over the gap. A plasmonic conductive layer is formed over the gap on the insulator layer to excite plasmons to provide signal transmission between the first and second plasmonic couplers.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: May 10, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Phaedon Avouris, Vasili Perebeinos, Mathias B. Steiner, Alberto Valdes Garcia
  • Publication number: 20160080092
    Abstract: A signal transfer link includes a first plasmonic coupler, and a second plasmonic coupler spaced apart from the first plasmonic coupler to form a gap. An insulator layer is formed over end portions of the first and second plasmonic couplers and in and over the gap. A plasmonic conductive layer is formed over the gap on the insulator layer to excite plasmons to provide signal transmission between the first and second plasmonic couplers.
    Type: Application
    Filed: November 30, 2015
    Publication date: March 17, 2016
    Inventors: PHAEDON AVOURIS, VASILI PEREBEINOS, MATHIAS B. STEINER, ALBERTO VALDES GARCIA
  • Patent number: 9250389
    Abstract: A signal transfer link includes a first plasmonic coupler, and a second plasmonic coupler spaced apart from the first plasmonic coupler to form a gap. An insulator layer is formed over end portions of the first and second plasmonic couplers and in and over the gap. A plasmonic conductive layer is formed over the gap on the insulator layer to excite plasmons to provide signal transmission between the first and second plasmonic couplers.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: February 2, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Phaedon Avouris, Vasili Perebeinos, Mathias B. Steiner, Alberto Valdes Garcia
  • Publication number: 20150346428
    Abstract: A signal transfer link includes a first plasmonic coupler, and a second plasmonic coupler spaced apart from the first plasmonic coupler to form a gap. An insulator layer is formed over end portions of the first and second plasmonic couplers and in and over the gap. A plasmonic conductive layer is formed over the gap on the insulator layer to excite plasmons to provide signal transmission between the first and second plasmonic couplers.
    Type: Application
    Filed: August 7, 2015
    Publication date: December 3, 2015
    Inventors: PHAEDON AVOURIS, VASILI PEREBEINOS, MATHIAS B. STEINER, ALBERTO VALDES GARCIA
  • Patent number: 9134481
    Abstract: A signal transfer link includes a first plasmonic coupler, and a second plasmonic coupler spaced apart from the first plasmonic coupler to form a gap. An insulator layer is formed over end portions of the first and second plasmonic couplers and in and over the gap. A plasmonic conductive layer is formed over the gap on the insulator layer to excite plasmons to provide signal transmission between the first and second plasmonic couplers.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: September 15, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Phaedon Avouris, Vasili Perebeinos, Mathias B. Steiner, Alberto Valdes Garcia