Abstract: The present invention relates to thermoelectric apparatuses for the production of thermoelectric coolers in radio electronics, medicine, and devices that are used in the conditions of repeatable temperature cycling (heating-cooling). The method of production of a thermoelectric micro-cooler includes forming on a first ceramic wafer a first conductive layer containing conductive traces; soldering legs of thermoelectric material to the conductive traces of the first conductive layer: forming on a temporary wafer a second conductive layer containing conductive traces: soldering the conductive traces of the second conductive layer to the legs of thermoelectric material; applying to the legs of thermoelectric material and soldered joints a protective coating; etching the temporary wafer; applying onto the second ceramic wafer an elastic conductive adhesive layer; adhering the second ceramic wafer to the conductive traces of the second conductive layer.

Abstract: The present invention relates to thermoelectric apparatuses for the production of thermoelectric coolers in radio electronics, medicine, and devices that are used in the conditions of repeatable temperature cycling (heating-cooling). The method of production of a thermoelectric micro-cooler includes forming on a first ceramic wafer a first conductive layer containing conductive traces; soldering legs of thermoelectric material to the conductive traces of the first conductive layer: forming on a temporary wafer a second conductive layer containing conductive traces: soldering the conductive traces of the second conductive layer to the legs of thermoelectric material; applying to the legs of thermoelectric material and soldered joints a protective coating; etching the temporary wafer; applying onto the second ceramic wafer an elastic conductive adhesive layer; adhering the second ceramic wafer to the conductive traces of the second conductive layer.