Abstract: An apparatus includes a plurality of circuit blocks, a plurality of scan-enabled flip-flop circuits, and a plurality of scan signature circuits. The plurality of scan-enabled flip-flop circuits may be coupled in a sequential manner across the plurality of circuit blocks, and be configured to shift a scan chain test signal from a test input interface to a test output interface. The plurality of scan signature circuits may be coupled to respective ones of a subset of the plurality of scan-enabled flip-flop circuits, and be configured to, in response to a particular test signal, concurrently load a known scan-chain pattern to the subset of the scan-enabled flip-flop circuits. The plurality of scan-enabled flip-flop circuits may be further configured to sequentially output at least a portion of the known scan-chain pattern to the test output interface.

Abstract: An apparatus includes a plurality of circuit blocks, a plurality of scan-enabled flip-flop circuits, and a plurality of scan signature circuits. The plurality of scan-enabled flip-flop circuits may be coupled in a sequential manner across the plurality of circuit blocks, and be configured to shift a scan chain test signal from a test input interface to a test output interface. The plurality of scan signature circuits may be coupled to respective ones of a subset of the plurality of scan-enabled flip-flop circuits, and be configured to, in response to a particular test signal, concurrently load a known scan-chain pattern to the subset of the scan-enabled flip-flop circuits. The plurality of scan-enabled flip-flop circuits may be further configured to sequentially output at least a portion of the known scan-chain pattern to the test output interface.

Abstract: Systems and methods are provided for detecting defects caused by cracks in an integrated circuit, which may arise during or after a silicon wafer is singulated into separate integrated circuits. An integrated circuit may include crack detection circuitry including a metal circuit. The metal circuit may fracture or break due to crack propagation through a portion of the integrated circuit. In the event of a crack, testing may detect the fracture of the metal circuit. The crack detection circuitry may also detect accurate operation of circuitry of the integrated circuit.

Abstract: A system and method for efficiently performing timing characterization of regions of an integrated circuit. An integrated circuit has monitors distributed in different physical regions across its die. Each monitor includes timing characterization and self-test circuitry. This circuitry includes one or more tunable delay lines used during timing measurements. The circuitry verifies the tunable delay lines are defect free prior to the timing measurements. If defects are detected, but tunable delay lines may still be used, a scaling factor may be generated for a failing tunable delay line. The scaling factor may be used during subsequent timing measurements to maintain a high accuracy for the measurements. The timing measurements may determine a particular physical region of the die provides fast or slow timing values. The resulting statistics of the timing measurements may be used to change an operational mode of the IC in at least the particular region.

Abstract: A system and method for efficiently performing timing characterization of regions of an integrated circuit. An integrated circuit has monitors distributed in different physical regions across its die. Each monitor includes timing characterization and self-test circuitry. This circuitry includes one or more tunable delay lines used during timing measurements. The circuitry verifies the tunable delay lines are defect free prior to the timing measurements. If defects are detected, but tunable delay lines may still be used, a scaling factor may be generated for a failing tunable delay line. The scaling factor may be used during subsequent timing measurements to maintain a high accuracy for the measurements. The timing measurements may determine a particular physical region of the die provides fast or slow timing values. The resulting statistics of the timing measurements may be used to change an operational mode of the IC in at least the particular region.