Abstract: A recording head includes one or more transducer elements, and an electrically insulative layer encasing the one or more transducer elements. The recording head also includes a substrate below the electrically insulative layer. The recording head further includes a heat sinking layer between the electrically insulative layer and the substrate.

Abstract: The present disclosure includes methods and systems that include multiple lapping stages having at least one lapping stage that laps while a heat source is applied to cause expansion during lapping and at least one subsequent lapping stage that laps while the heat source is reduced (e.g., turned off).

Abstract: A recording head includes one or more transducer elements, and an electrically insulative layer encasing the one or more transducer elements. The recording head also includes a substrate below the electrically insulative layer. The recording head further includes a heat sinking layer between the electrically insulative layer and the substrate.

Abstract: An apparatus comprising a slider is configured for heat-assisted magnetic recording. The slider comprises a media-facing surface. One or more reader elements are positioned in a reader region of the slider, and the one or more reader elements have an average first elevation at the media-facing surface. One or more writer elements are positioned in a writer region of the slider, and the one or more writer elements have an average second elevation at the media-facing surface. The average second elevation is less than the average first elevation.

Abstract: A slider has a read transducer comprising first and second shields surrounding a read sensor. The first shield faces a substrate. A first end of the reader stack is at a media-facing surface of the slider and a second end of the reader stack faces away from the first end. A heater is located farther away from the media-facing surface than the second end of the read transducer. The heater is configured to control a thermal protrusion of the read transducer from the media-facing surface. A heat sink is located between the first shield and the substrate.

Abstract: An apparatus comprises a slider configured for heat assisted magnetic recording and comprising a substrate. At least one component of the slider generates heat when energized. At least one thermal via extends through a portion of the slider from a location proximate the component to the substrate. The thermal via is configured to conduct heat away from the component and to the substrate.

Abstract: An apparatus comprises a slider configured for heat assisted magnetic recording and comprising a substrate. At least one component of the slider generates heat when energized. At least one thermal via extends through a portion of the slider from a location proximate the component to the substrate. The thermal via is configured to conduct heat away from the component and to the substrate.

Abstract: A slider configured for heat-assisted magnetic recording comprises an air bearing surface (ABS), a writer, and a close point of the writer. A plurality of heat producing or dissipating components are situated a predetermined distance from a vertical plane that is normal to the ABS and aligned with the close point. A location of the writer close point remains substantially consistent irrespective of which of the plurality of heat producing or dissipating components are energized.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: Various embodiments of a magnetic stack are disclosed. In one or more embodiments, the magnetic stack includes first and second shield layers, and a magnetically responsive lamination disposed between the first and second shield layers. The magnetically responsive lamination can be configured to receive a sense current IS therethrough. The magnetic stack also includes a cooling element disposed between the first and second shield layers and thermally coupled to the magnetically responsive lamination. The cooling element can be configured to receive a bias current IB therethrough. And the cooling element can be configured to cool the magnetically responsive lamination during a read function.

Abstract: A device including a magnetic transducer; top and bottom magnetic shields, wherein the top and bottom magnetic shields are adjacent the magnetic transducer on opposite surfaces thereof; a heating element configured to provide heating along a heating path towards the first and second magnetic shields; and a low thermal conductivity structure, wherein at least a portion of the low thermal conductivity structure is positioned along the heating path between the heating element and the magnetic transducer.

Abstract: A device including a magnetic transducer; top and bottom magnetic shields, wherein the top and bottom magnetic shields are adjacent the magnetic transducer on opposite surfaces thereof; a heating element configured to provide heating along a heating path towards the first and second magnetic shields; and a low thermal conductivity structure, wherein at least a portion of the low thermal conductivity structure is positioned along the heating path between the heating element and the magnetic transducer.